Inventor · disambiguated record
Mikio Nishihara
Also filed as: NISHIHARA MIKIO · ODA MASAHIRO
11 granted patents·395 citations·filing 1976–2000
92Inventor score
Files withFUJITSU LTD11
Top patents by PatentIndex Score
11 records- 0196US5475922AMethod of assembling a connector using frangible contact partsFUJITSU LTD·Filed 1994·Granted Dec 19, 1995·148 cites·4 claims
- 0292US4298770APrinted boardFUJITSU LTD·Filed 1979·Granted Nov 3, 1981·65 cites·14 claims
- 0385US6485814B1High density thin film circuit board and method of production thereofFUJITSU LTD·Filed 2000·Granted Nov 26, 2002·35 cites·9 claims
- 0484US4675789AHigh density multilayer printed circuit boardFUJITSU LTD·Filed 1985·Granted Jun 23, 1987·54 cites·3 claims
- 0583US4150421AMulti-layer printed circuit boardFUJITSU LTD·Filed 1978·Granted Apr 17, 1979·41 cites·4 claims
- 0663US4692843AMultilayer printed wiring boardFUJITSU LTD·Filed 1986·Granted Sep 8, 1987·23 cites·2 claims
- 0741US4785141AWiring structure of termination circuitFUJITSU LTD·Filed 1987·Granted Nov 15, 1988·9 cites·1 claims
- 0837US5181317AMethod of making an engineering change to a printed wiring boardFUJITSU LTD·Filed 1991·Granted Jan 26, 1993·9 cites·8 claims
- 0935US5496971ACircuit arrangement for multilayer printed circuit boardFUJITSU LTD·Filed 1994·Granted Mar 5, 1996·7 cites·3 claims
- 1031US5354209AConnector and method of assembling the sameFUJITSU LTD·Filed 1993·Granted Oct 11, 1994·2 cites·3 claims
- 1131US4159508AMultilayer printed wiring boardFUJITSU LTD·Filed 1976·Granted Jun 26, 1979·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →