Inventor · disambiguated record
Min-Ho O
Also filed as: O MIN HO
2 granted patents·5 pending applications·20 citations·filing 2007–2008
59Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0180US7888785B2Semiconductor package embedded in substrate, system including the same and associated methodsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 15, 2011·11 cites·19 claims
- 0277US7626254B2Semiconductor package using chip-embedded interposer substrateSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 1, 2009·9 cites·8 claims
- 0362US2009197090A1Composition, anti-oxide film including the same, electronic component including the anti-oxide film, and methods for forming the anti-oxide film and electronic componentSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0444US2008308935A1Semiconductor chip package, semiconductor package including semiconductor chip package, and method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0543US2009115069A1Semiconductor chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0643US2008265432A1Multi-chip package and method of manufacturing the multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0740US2008124547A1Partially insulation coated metal wire for wire bonding and wire bonding method for semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →