Inventor · disambiguated record
Mitsukazu Ochi
Also filed as: OCHI MITSUKAZU
5 granted patents·5 pending applications·58 citations·filing 1992–2006
81Inventor score
Top patents by PatentIndex Score
10 records- 0164US5597876AEpoxy resin composition containing novolac with adjacent hydroxyl groupsSHELL OIL CO·Filed 1996·Granted Jan 28, 1997·22 cites·14 claims
- 0263US5334662AEpoxy resin/phenolic OH-aramid/ban block copolymer product with CTBNTOMOEGAWA PAPER CO LTD·Filed 1993·Granted Aug 2, 1994·15 cites·2 claims
- 0355US6005060AEpoxy resin composition and cured composite productSHELL OIL CO·Filed 1998·Granted Dec 21, 1999·13 cites·14 claims
- 0447US2009131609A1Episulfide Group-Substituted Silicon Compound and Thermosetting Resin Composition Containing SameOCHI MITSUKAZU·Filed 2006·Application pending·0 cites
- 0546US2007116938A1Polymer composite formed article, printed wiring board using the formed article, and methods of producing themTOBITA MASAYUKI·Filed 2005·Application pending·0 cites
- 0641US2005171318A1Curable resin compositionYOKOHAMA RUBBER CO LTD·Filed 2005·Application pending·0 cites
- 0737US2004224163A1Thermally-conductive epoxy resin molded article and method of producing the samePOLYMATECH CO LTD·Filed 2004·Application pending·0 cites
- 0836US5258456AEpoxy resin with phenolic OH-aramide/ban block copolymerTOMOEGAWA PAPER CO LTD·Filed 1992·Granted Nov 2, 1993·5 cites·13 claims
- 0936US2004102597A1Thermally-conductive epoxy resin molded article and method of manufacturing the sameFiled 2003·Application pending·0 cites
- 1032US5334661AEpoxy resin reacted with phenolic OH-aramide/banTOMOEGAWA PAPER CO LTD·Filed 1993·Granted Aug 2, 1994·3 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →