Inventor · disambiguated record
Mitsuki Onoda
Also filed as: ONODA MITSUKI
2 granted patents·6 pending applications·0 citations·filing 2019–2022
22Inventor score
Files withKOEI CHEMICAL CO8
Top patents by PatentIndex Score
8 records- 0160US2025034316A1Curable composition, cured product and curing catalyst for blocked isocyanate compoundKOEI CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0256US12466912B2Blocked polyisocyanate composition, heat-curable resin composition, cured product, and production method thereforKOEI CHEMICAL CO·Filed 2021·Granted Nov 11, 2025·0 cites·12 claims
- 0352US2023202988A1Amidate compound, production method therefor, blocking-agent dissociation catalyst, and thermally curable resin compositionKOEI CHEMICAL CO·Filed 2021·Application pending·0 cites
- 0451US12291506B2Method for producing amidate compound, and amidate compoundKOEI CHEMICAL CO·Filed 2019·Granted May 6, 2025·0 cites·10 claims
- 0550US2023167229A1Blocked isocyanate composition, heat-curable resin composition, cured product, production method therefor, amidate compound, and catalyst for dissociation of blocking agent for blocked isocyanatesKOEI CHEMICAL CO·Filed 2021·Application pending·0 cites
- 0650US2025122322A1Zwitterionic compound, and blocking agent dissociation catalyst for blocked isocyanate, blocked isocyanate composition containing blocking agent dissociation catalyst, thermosetting resin composition, cured product and method for manufacturing same, and carbonate compoundKOEI CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0750US2025122323A1Onium salt, blocking agent dissociation catalyst for blocked isocyanate, blocked isocyante composition including blocking agent dissociation catalyst, thermosetting resin composition, and cured product and manufacturing method thereforKOEI CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0844US2023095854A1Method for producing carboxylate compound and method for producing amidate compoundKOEI CHEMICAL CO·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →