Inventor · disambiguated record
Mitsunada Osawa
Also filed as: OSAWA MITSUNADA
10 granted patents·2 pending applications·462 citations·filing 1992–2002
92Inventor score
Top patents by PatentIndex Score
12 records- 0192US6881611B1Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the deviceFUJITSU LTD·Filed 2000·Granted Apr 19, 2005·85 cites·24 claims
- 0288US6379997B1Semiconductor device and method of producing the same and semiconductor device unit and method of producing the sameFUJITSU LTD·Filed 2000·Granted Apr 30, 2002·54 cites·11 claims
- 0387US5679978ASemiconductor device having resin gate hole through substrate for resin encapsulationFUJITSU LTD·Filed 1994·Granted Oct 21, 1997·96 cites·15 claims
- 0486US6111306ASemiconductor device and method of producing the same and semiconductor device unit and method of producing the sameFUJITSU LTD·Filed 1997·Granted Aug 29, 2000·83 cites·12 claims
- 0577US6696754B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 2002·Granted Feb 24, 2004·20 cites·10 claims
- 0673US5844309AAdhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the compositionFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·46 cites·14 claims
- 0768US6472744B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 1998·Granted Oct 29, 2002·31 cites·17 claims
- 0853US5226582AMethod for wire-bonding an integrated circuitFUJITSU LTD·Filed 1992·Granted Jul 13, 1993·23 cites·7 claims
- 0948US5804467ASemiconductor device and method of producing the sameFUJISTSU LIMITED·Filed 1997·Granted Sep 8, 1998·15 cites·12 claims
- 1040US6034428ASemiconductor integrated circuit device having stacked wiring and insulating layersFUJITSU LTD·Filed 1996·Granted Mar 7, 2000·9 cites·7 claims
- 1138US2002030258A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFUJITSU LTD·Filed 2001·Application pending·0 cites
- 1230US2001003049A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFiled 1997·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →