Inventor · disambiguated record
Ming-Yen Pan
Also filed as: PAN MING · PAN MING-YEN
2 granted patents·7 pending applications·0 citations·filing 2022–2024
22Inventor score
Top patents by PatentIndex Score
9 records- 0158US2025142730A1Power component submount and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0258US2024379651A1Device isolation structure and manufacturing method thereof, and semiconductor deviceHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 0351US2025107299A1Light emitting diode package structure and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0448US2024304461A1Ceramic submount for semiconductor device and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0546US12432852B2Circuit board structure with embedded ceramic substrate and manufacturing process thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Sep 30, 2025·0 cites·10 claims
- 0644US12500092B2Chip package structure and method for fabricating the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Dec 16, 2025·0 cites·7 claims
- 0743US2024284592A1Printed circuit board and method for making the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0843US2024276650A1Circuit board and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0941US2024032204A1Method for manufacturing conductive circuit board and conductive circuit board made therefromTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →