Inventor · disambiguated record
Mi Jin Park
Also filed as: PARK MI JIN
26 granted patents·10 pending applications·41 citations·filing 2010–2024
93Inventor score
Files withSAMSUNG DISPLAY CO LTD11SAMSUNG ELECTRO MECH11SAMSUNG ELECTRONICS CO LTD5PARK SEUNG WOOK3GFLAS LIFE SCIENCES INC2
Top patents by PatentIndex Score
36 records- 0196US11848409B2Display device including a pad unit and a driver connected to a pixel through the pad unitSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Dec 19, 2023·2 cites·10 claims
- 0296US11393964B2Plurality of contact electrode connected to a light emitting elementSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Jul 19, 2022·3 cites·20 claims
- 0395US11785824B2Display device and manufacturing method thereofSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Oct 10, 2023·3 cites·14 claims
- 0492US8830689B2Interposer-embedded printed circuit boardKIM JIN GU·Filed 2011·Granted Sep 9, 2014·19 cites·7 claims
- 0585US11552144B2Light emitting diode display deviceSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Jan 10, 2023·1 cites·12 claims
- 0685US2025089426A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 0784US12155027B2Display device including a pad unit connected to a pixelSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·17 claims
- 0882US11462518B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Oct 4, 2022·1 cites·20 claims
- 0981US11233104B2Light emitting diode display deviceSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Jan 25, 2022·1 cites·21 claims
- 1077US10559541B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 11, 2020·2 cites·20 claims
- 1175US11862581B2Semiconductor package including conductive crack preventing layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 1273US11923346B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·24 claims
- 1370US8582314B2Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structurePARK SEUNG WOOK·Filed 2010·Granted Nov 12, 2013·3 cites·5 claims
- 1469US9253880B2Printed circuit board including a plurality of circuit layers and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Granted Feb 2, 2016·3 cites·10 claims
- 1567US11417612B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 1663US9204533B2Asymmetrical multilayer substrate, RF module, and method for manufacturing asymmetrical multilayer substrateSAMSUNG ELECTRO MECH·Filed 2012·Granted Dec 1, 2015·1 cites·20 claims
- 1761US11491208B2Sequence-specific in vivo cell targetingGFLAS LIFE SCIENCES INC·Filed 2020·Granted Nov 8, 2022·0 cites·10 claims
- 1860US8373537B2Resistor having parallel structure and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2010·Granted Feb 12, 2013·1 cites·17 claims
- 1960US2022313796A1Sequence-specific in vivo cell targetingGFLAS LIFE SCIENCES INC·Filed 2022·Application pending·0 cites
- 2059US10854561B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 1, 2020·0 cites·20 claims
- 2159US10756030B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·0 cites·16 claims
- 2256US12183769B2Display device and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·25 claims
- 2355US9095068B2Circuit boardSAMSUNG ELECTRO MECH·Filed 2012·Granted Jul 28, 2015·0 cites·9 claims
- 2454US8987888B2Semiconductor package and semiconductor package module having the samePARK MI JIN·Filed 2012·Granted Mar 24, 2015·1 cites·15 claims
- 2553US11552215B2Method of manufacturing display device and display deviceSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Jan 10, 2023·0 cites·11 claims
- 2650US2014338955A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2745US8581394B2Semiconductor package module and electric circuit assembly with the samePARK SEUNG WOOK·Filed 2010·Granted Nov 12, 2013·0 cites·8 claims
- 2845US2015055312A1Interposer substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2945US2013168143A1Circuit boardPARK SEUNG WOOK·Filed 2012·Application pending·0 cites
- 3044US9236339B2Plug via stacked structure, stacked substrate having via stacked structure and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Granted Jan 12, 2016·0 cites·20 claims
- 3143US2011269413A1Circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 3242US11865164B2Pharmaceutical composition for treating cancer, containing guide RNA and endonuclease as active ingredientsG FLAS LIFE SCIENCES·Filed 2019·Granted Jan 9, 2024·0 cites·6 claims
- 3339US2014061864A1Semiconductor substrate having crack preventing structure and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3435US2016198568A1Printed circuit board and electronic component moduleSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 3531US2013075144A1Package substrate with mesh pattern and method for manufacturing the samePARK MI JIN·Filed 2012·Application pending·0 cites
- 3630US2017365567A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →