Inventor · disambiguated record
Mihyae Park
Also filed as: PARK MIHYAE
1 granted patent·3 pending applications·0 citations·filing 2021–2024
10Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0150US11876031B2Thermal interface material paste and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·18 claims
- 0247US2024038551A1Coating composition for wafer protection and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0346US2025022811A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0442US2024063085A1Thermal interfacial material film, semiconductor package, method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →