Inventor · disambiguated record
Mitesh Patel
Also filed as: PATEL MITESH · PATEL MITESH C
10 granted patents·1 pending application·61 citations·filing 2003–2007
88Inventor score
Files withINTEL CORP11
Top patents by PatentIndex Score
11 records- 0192US7332807B2Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing sameINTEL CORP·Filed 2005·Granted Feb 19, 2008·26 cites·19 claims
- 0275US7179689B2Package stress managementINTEL CORP·Filed 2005·Granted Feb 20, 2007·6 cites·13 claims
- 0371US7291548B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2007·Granted Nov 6, 2007·5 cites·20 claims
- 0467US7776657B2Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing sameINTEL CORP·Filed 2007·Granted Aug 17, 2010·3 cites·10 claims
- 0565US7170188B2Package stress managementINTEL CORP·Filed 2004·Granted Jan 30, 2007·11 cites·14 claims
- 0658US7518091B2Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted materialINTEL CORP·Filed 2006·Granted Apr 14, 2009·1 cites·6 claims
- 0749US7584536B2Process for precise alignment of packaging caps on a substrateINTEL CORP·Filed 2007·Granted Sep 8, 2009·0 cites·11 claims
- 0848US7275312B2Apparatus for precise alignment of packaging caps on a substrateINTEL CORP·Filed 2003·Granted Oct 2, 2007·3 cites·27 claims
- 0948US7119314B2Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted materialINTEL CORP·Filed 2004·Granted Oct 10, 2006·3 cites·15 claims
- 1047US7253088B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2004·Granted Aug 7, 2007·3 cites·12 claims
- 1140US2007152325A1Chip package dielectric sheet for body-biasingINTEL CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →