Inventor · disambiguated record
Mikhail Pevzner
Also filed as: PEVZNER MIKHAIL
11 granted patents·2 pending applications·5 citations·filing 2019–2023
80Inventor score
Files withRAYTHEON CO13
Top patents by PatentIndex Score
13 records- 0187US10999938B1Method of wire bonding a first and second circuit cardRAYTHEON CO·Filed 2020·Granted May 4, 2021·3 cites·5 claims
- 0286US11122692B1Preparation of solder bump for compatibility with printed electronics and enhanced via reliabilityRAYTHEON CO·Filed 2020·Granted Sep 14, 2021·2 cites·12 claims
- 0372US2023209728A1Method for forming channels in printed circuit boards by stacking slotted layersRAYTHEON CO·Filed 2023·Application pending·0 cites
- 0467US11470725B2Method for fabricating Z-axis vertical launchRAYTHEON CO·Filed 2021·Granted Oct 11, 2022·0 cites·8 claims
- 0567US2021400820A1Preparation of solder bump for compatibility with printed electronics and enhanced via reliabilityRAYTHEON CO·Filed 2021·Application pending·0 cites
- 0660US11606865B2Method for forming channels in printed circuit boards by stacking slotted layersRAYTHEON CO·Filed 2019·Granted Mar 14, 2023·0 cites·8 claims
- 0760US11497118B2Method for manufacturing non-planar arrays with a single flex-hybrid circuit cardRAYTHEON CO·Filed 2021·Granted Nov 8, 2022·0 cites·19 claims
- 0859US11109489B2Apparatus for fabricating Z-axis vertical launch within a printed circuit boardRAYTHEON CO·Filed 2019·Granted Aug 31, 2021·0 cites·13 claims
- 0958US12249752B2Collapsible dielectric standoffRAYTHEON CO·Filed 2022·Granted Mar 11, 2025·0 cites·16 claims
- 1055US11317502B2PCB cavity mode suppressionRAYTHEON CO·Filed 2020·Granted Apr 26, 2022·0 cites·18 claims
- 1154US11171101B2Process for removing bond film from cavities in printed circuit boardsRAYTHEON CO·Filed 2020·Granted Nov 9, 2021·0 cites·20 claims
- 1251US12266629B2Ball bond impedance matchingRAYTHEON CO·Filed 2021·Granted Apr 1, 2025·0 cites·13 claims
- 1342US11653484B2Printed circuit board automated layup systemRAYTHEON CO·Filed 2019·Granted May 16, 2023·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →