Inventor · disambiguated record

Michael Ras

Also filed as: RAS MICHAEL

1 granted patent·0 citations·filing 2019–2019

6Inventor score

Technology areasB29C

Files withDDP SPECIALTY ELECTRONIC MATERIALS US LLC1

Top patents by PatentIndex Score

1 record

0151US11173672B2Method for bonding using one-component epoxy adhesive mixturesDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2019·Granted Nov 16, 2021·0 cites·11 claims

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