Inventor · disambiguated record
Miriam Reshotko
Also filed as: RESHOTKO MIRIAM · RESHOTKO MIRIAM R · RESHOTKO MIRIAM RUTH
30 granted patents·10 pending applications·280 citations·filing 2002–2024
96Inventor score
Top patents by PatentIndex Score
40 records- 0198US11444024B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2020·Granted Sep 13, 2022·10 cites·30 claims
- 0295US12027458B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2022·Granted Jul 2, 2024·2 cites·20 claims
- 0395US6856129B2Current probe device having an integrated amplifierINTEL CORP·Filed 2002·Granted Feb 15, 2005·115 cites·26 claims
- 0494US7700975B2Schottky barrier metal-germanium contact in metal-germanium-metal photodetectorsINTEL CORP·Filed 2006·Granted Apr 20, 2010·26 cites·17 claims
- 0592US8290325B2Waveguide photodetector device and manufacturing method thereofRESHOTKO MIRIAM R·Filed 2008·Granted Oct 16, 2012·34 cites·26 claims
- 0691US9182544B2Fabrication of planar light-wave circuits (PLCS) for optical I/OKOBRINSKY MAURO J·Filed 2011·Granted Nov 10, 2015·16 cites·20 claims
- 0785US8731346B2Waveguide integration on laser for alignment-tolerant assemblyTSENG JIA-HUNG·Filed 2012·Granted May 20, 2014·14 cites·21 claims
- 0885US7084471B2Photosensitive deviceINTEL CORP·Filed 2005·Granted Aug 1, 2006·6 cites·26 claims
- 0983US12482744B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2024·Granted Nov 25, 2025·0 cites·19 claims
- 1083US10665499B2Integrated circuit with airgaps to control capacitanceINTEL CORP·Filed 2018·Granted May 26, 2020·4 cites·23 claims
- 1180US7948010B2Dual seed semiconductor photodetectorsINTEL CORP·Filed 2009·Granted May 24, 2011·4 cites·7 claims
- 1280US6813431B2Integrated photodevice and waveguideINTEL CORP·Filed 2002·Granted Nov 2, 2004·22 cites·22 claims
- 1379US11417775B2Nanowire thin film transistors with textured semiconductorsINTEL CORP·Filed 2018·Granted Aug 16, 2022·2 cites·25 claims
- 1479US7553687B2Dual seed semiconductor photodetectorsINTEL CORP·Filed 2006·Granted Jun 30, 2009·4 cites·11 claims
- 1578US7692258B2Photosensitive deviceINTEL CORP·Filed 2006·Granted Apr 6, 2010·3 cites·13 claims
- 1673US6903432B2Photosensitive deviceINTEL CORP·Filed 2003·Granted Jun 7, 2005·13 cites·19 claims
- 1770US11527656B2Contact electrodes for vertical thin-film transistorsINTEL CORP·Filed 2018·Granted Dec 13, 2022·1 cites·20 claims
- 1869US11264317B2Antifuse memory arrays with antifuse elements at the back-end-of-line (BEOL)INTEL CORP·Filed 2018·Granted Mar 1, 2022·2 cites·26 claims
- 1968US11894270B2Grating replication using helmets and topographically-selective depositionINTEL CORP·Filed 2022·Granted Feb 6, 2024·0 cites·8 claims
- 2068US11444205B2Contact stacks to reduce hydrogen in thin film transistorINTEL CORP·Filed 2018·Granted Sep 13, 2022·1 cites·23 claims
- 2167US11843054B2Vertical architecture of thin film transistorsINTEL CORP·Filed 2018·Granted Dec 12, 2023·1 cites·23 claims
- 2256US12396155B2Backend memory with air gaps in upper metal layersINTEL CORP·Filed 2021·Granted Aug 19, 2025·0 cites·20 claims
- 2355US11335598B2Grating replication using helmets and topographically-selective depositionINTEL CORP·Filed 2018·Granted May 17, 2022·0 cites·10 claims
- 2454US12500162B2Staggered vertically spaced integrated circuit line metallization with differential vias and metal-selective depositionINTEL CORP·Filed 2021·Granted Dec 16, 2025·0 cites·12 claims
- 2553US11664305B2Staggered lines for interconnect performance improvement and processes for forming suchINTEL CORP·Filed 2019·Granted May 30, 2023·0 cites·20 claims
- 2652US2024170394A1Integrated circuit interconnect level comprising multi-height lines & self-aligned viasINTEL CORP·Filed 2022·Application pending·0 cites
- 2750US11646266B2Helmet structures for semiconductor interconnectsINTEL CORP·Filed 2019·Granted May 9, 2023·0 cites·23 claims
- 2848US11610810B2Maskless air gap enabled by a single damascene processINTEL CORP·Filed 2018·Granted Mar 21, 2023·0 cites·9 claims
- 2947US2022102268A1Damascene interconnect structures with low resistance vias for integrated circuitsINTEL CORP·Filed 2020·Application pending·0 cites
- 3047US2007235877A1Integration scheme for semiconductor photodetectors on an integrated circuit chipRESHOTKO MIRIAM·Filed 2006·Application pending·0 cites
- 3147US2023369506A1Laterally recessed gate electrode in thin film transistorsINTEL CORP·Filed 2022·Application pending·0 cites
- 3246US2023371233A1Multi-tier memory structure with graded characteristicsINTEL CORP·Filed 2022·Application pending·0 cites
- 3346US2023395506A1Self-aligned staggered integrated circuit interconnect featuresINTEL CORP·Filed 2022·Application pending·0 cites
- 3446US2008001181A1Complementarily doped metal-semiconductor interfaces to reduce dark current in MSM photodetectorsRAKSHIT TITASH·Filed 2006·Application pending·0 cites
- 3544US2022139772A1Interconnect structures with area selective adhesion or barrier materials for low resistance vias in integrated circuitsINTEL CORP·Filed 2020·Application pending·0 cites
- 3643US12009433B2Multi-dielectric gate stack for crystalline thin film transistorsINTEL CORP·Filed 2018·Granted Jun 11, 2024·0 cites·8 claims
- 3742US2020006570A1Contact structures for thin film transistor devicesINTEL CORP·Filed 2018·Application pending·0 cites
- 3840US11749560B2Cladded metal interconnectsINTEL CORP·Filed 2018·Granted Sep 5, 2023·0 cites·19 claims
- 3939US2014086523A1Poling structures and methods for photonic devices employing electro-optical polymersBLOCK BRUCE A·Filed 2012·Application pending·0 cites
- 4038US12183831B2Self-aligned contacts for thin film transistorsINTEL CORP·Filed 2017·Granted Dec 31, 2024·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →