Inventor · disambiguated record

Min-Woo Rhee

Also filed as: RHEE MIN WOO

1 granted patent·1 pending application·0 citations·filing 2018–2025

5Inventor score

Technology areasH01R H10P

Files withSAMSUNG ELECTRONICS CO LTD2

Top patents by PatentIndex Score

2 records

0151US2025385215A1Hybrid bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
0235US10514392B2Probe card, test apparatus including the probe card, and related methods of manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 24, 2019·0 cites·18 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →