Inventor · disambiguated record
Minwoo Rhee
Also filed as: RHEE MINWOO
3 granted patents·16 pending applications·0 citations·filing 2020–2024
42Inventor score
Top patents by PatentIndex Score
19 records- 0171US2024367376A13d printing apparatus and 3d printing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0268US2025249545A1Polishing process apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0365US12070903B23D printing apparatus and 3D printing methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·19 claims
- 0456US2025140588A1Die bonding apparatus and die bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0556US2025201602A1Hybrid bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0656US2025180994A1Selective photoresist application method and semiconductor package manufacturing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0755US2025219011A1Chuck for wafer bonding deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0853US2024282604A1Semiconductor processing apparatus and method of manufacturing semiconductor device using semiconductor processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0953US2024170445A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1052US2025233048A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1151US2023178511A1Method for manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1251US2024321805A1Wet atomic layer etching method and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1350US2025070079A1Manufacturing method of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1449US2025054878A1Warpage controlSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1549US2024145416A1Substrate bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1649US2024186282A1Die bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1747US11581188B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 1846US12112970B2Substrate transfer apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 8, 2024·0 cites·20 claims
- 1944US2023113869A1Substrate transfer apparatusSAMSUNG ELECTRONICS LTD·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Minwoo Rhee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →