Inventor · disambiguated record
Mike Sapozhnikov
Also filed as: SAPOZHNIKOV MIKE
16 granted patents·18 pending applications·9 citations·filing 2015–2024
87Inventor score
Top patents by PatentIndex Score
34 records- 0182US10674598B1Measuring effective dielectric constant using via-stub resonanceCISCO TECH INC·Filed 2019·Granted Jun 2, 2020·3 cites·20 claims
- 0280US11482802B2High speed traceless interconnectCISCO TECH INC·Filed 2021·Granted Oct 25, 2022·1 cites·20 claims
- 0376US10431914B2Network connector assemblyCISCO TECH INC·Filed 2017·Granted Oct 1, 2019·4 cites·20 claims
- 0474US10684123B2Fiber weave skew assessment for printed circuit boardsCISCO TECH INC·Filed 2018·Granted Jun 16, 2020·1 cites·10 claims
- 0573US11781858B2Fiber weave skew assessment for printed circuit boardsCISCO TECH INC·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 0673US11761755B2Fiber weave skew assessment for printed circuit boardsCISCO TECH INC·Filed 2021·Granted Sep 19, 2023·0 cites·19 claims
- 0768US12512612B2Cable termination connection assemblyCISCO TECH INC·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0868US12003282B2Channel predictive behavior and fault analysisCISCO TECH INC·Filed 2023·Granted Jun 4, 2024·0 cites·20 claims
- 0968US11293752B2Fiber weave skew assessment for printed circuit boardsCISCO TECH INC·Filed 2020·Granted Apr 5, 2022·0 cites·20 claims
- 1068US11287245B2Fiber weave skew assessment for printed circuit boardsCISCO TECH INC·Filed 2020·Granted Mar 29, 2022·0 cites·20 claims
- 1165US11777239B2Twinaxial cable port structure coupled to an integrated circuit socketCISCO TECH INC·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 1262US11606152B2Channel predictive behavior and fault analysisCISCO TECH INC·Filed 2021·Granted Mar 14, 2023·0 cites·17 claims
- 1358US2025275055A1Novel high-speed via impedance matching methodology using low dielectric constant backdrill filling materialCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1455US11425821B2Optimizing design and performance for printed circuit boardsCISCO TECH INC·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 1555US2025133652A1Printed circuit board assemblyCISCO TECH INC·Filed 2023·Application pending·0 cites
- 1655US2024345180A1System and method for determining cable performance based on frequency dependent skewCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1755US2025029931A1Package assembly for integrated circuitCISCO TECH INC·Filed 2023·Application pending·0 cites
- 1855US2025311091A1Pcb with breakout to enable higher density, layer count and enhanced performanceCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1954US2025151198A1Power method for higher current asic power deliveryCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2054US2024355737A1Via ground structuresCISCO TECH INC·Filed 2023·Application pending·0 cites
- 2154US2025107055A1Absorber for printed circuit board assemblyCISCO TECH INC·Filed 2023·Application pending·0 cites
- 2254US2025261301A1Managing crosstalk for high data rate interfacesCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2354US2025240873A1Multi-lamination structure that eliminates micro cavity resonanceCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2454US2025240870A1Power delivery system for high density signaling and high power delivery applicationCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2553US10735039B1Removal of channel impairments due to skew and channel asymmetry with a composite filterCISCO TECH INC·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 2653US2025212319A1Balancing loss across all ports on printed circuit board tracesCISCO TECH INC·Filed 2023·Application pending·0 cites
- 2753US2025140447A1Coupled conductors in twinax cable and stripline printed circuit board for skew mitigationCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2853US2025253271A1Integrating high permeability material in solder ball connectionCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2952US12142578B2Stiffener ring combined with ASIC power deliveryCISCO TECH INC·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 3052US2023378677A1High speed and high density cable interconnectsCISCO TECH INC·Filed 2023·Application pending·0 cites
- 3152US2025280496A1Via assembly for printed circuit boardCISCO TECH INC·Filed 2024·Application pending·0 cites
- 3250US11894296B2Integrated circuit package with heatsinkCISCO TECH INC·Filed 2021·Granted Feb 6, 2024·0 cites·19 claims
- 3350US2024332154A1Ball map patternCISCO TECH INC·Filed 2023·Application pending·0 cites
- 3431US2017132055A1Determining Physical Layer Error Signatures of a Communications LinkWU HUI·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →