Inventor · disambiguated record
Michael P. Schmidt-Lange
Also filed as: SCHMIDT-LANGE MICHAEL · SCHMIDT-LANGE MICHAEL P
12 granted patents·5 pending applications·35 citations·filing 2005–2024
88Inventor score
Top patents by PatentIndex Score
17 records- 0188US9093549B2Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2014·Granted Jul 28, 2015·8 cites·30 claims
- 0286US9425162B2Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2015·Granted Aug 23, 2016·5 cites·14 claims
- 0383US9478516B2Methods of operating bonding machines for bonding semiconductor elements, and bonding machinesKULICKE & SOFFA IND INC·Filed 2015·Granted Oct 25, 2016·4 cites·15 claims
- 0481US9136243B2Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elementsKULICKE & SOFFA IND INC·Filed 2014·Granted Sep 15, 2015·6 cites·21 claims
- 0571US9425163B2Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elementsKULICKE & SOFFA IND INC·Filed 2015·Granted Aug 23, 2016·2 cites·24 claims
- 0670US9165902B2Methods of operating bonding machines for bonding semiconductor elements, and bonding machinesKULICKE & SOFFA IND INC·Filed 2014·Granted Oct 20, 2015·2 cites·11 claims
- 0767US9847314B2Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2016·Granted Dec 19, 2017·1 cites·22 claims
- 0864US9373530B2Tool for picking a planar object from a supply stationSCHMIDT-LANGE MICHAEL·Filed 2010·Granted Jun 21, 2016·4 cites·15 claims
- 0961US7681774B2Bond head link assembly for a wire bonding machineKULICKE & SOFFA IND INC·Filed 2008·Granted Mar 23, 2010·2 cites·10 claims
- 1059US2025112201A1Bonding systems, and methods of bonding a semiconductor element to a substrateKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 1159US2024332244A1Methods of processing a substrate on a bonding system, and related bonding systemsKULICKE & SOFFA IND INC·Filed 2024·Application pending·0 cites
- 1256US7377415B2Bond head link assembly for a wire bonding machineKULICKE & SOFFA IND INC·Filed 2005·Granted May 27, 2008·1 cites·8 claims
- 1346US2009250503A1z-axis motion system for a wire bonding machineKULICKE & SOFFA IND INC·Filed 2006·Application pending·0 cites
- 1445US2011121053A1Z-axis motion system for a wire bonding machineKULICKE & SOFFA IND INC·Filed 2011·Application pending·0 cites
- 1545US2011114703A1Z-axis motion system for a wire bonding machineKULICKE & SOFFA IND INC·Filed 2011·Application pending·0 cites
- 1642US10245668B2Fluxing systems, bonding machines including fluxing systems, and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2017·Granted Apr 2, 2019·0 cites·19 claims
- 1741US9731378B2Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bondingKULICKE & SOFFA IND INC·Filed 2016·Granted Aug 15, 2017·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →