Inventor · disambiguated record
Mitsuharu Shimizu
Also filed as: SHIMIZU MITSUHARU
14 granted patents·2 pending applications·638 citations·filing 1990–2001
94Inventor score
Technology areasH10W
Files withSHINKO ELECTRIC IND CO16
Top patents by PatentIndex Score
16 records- 0195US5410180AMetal plane support for multi-layer lead frames and a process for manufacturing such framesSHINKO ELECTRIC IND CO·Filed 1993·Granted Apr 25, 1995·220 cites·26 claims
- 0281US5293301ASemiconductor device and lead frame used thereinSHINKO ELECTRIC IND CO·Filed 1991·Granted Mar 8, 1994·69 cites·4 claims
- 0374US5237202ALead frame and semiconductor device using sameSHINKO ELECTRIC IND CO·Filed 1991·Granted Aug 17, 1993·52 cites·19 claims
- 0470US5291060ALead frame and semiconductor device using sameSHINKO ELECTRIC IND CO·Filed 1992·Granted Mar 1, 1994·43 cites·20 claims
- 0569US6074567AMethod for producing a semiconductor packageSHINKO ELECTRIC IND CO·Filed 1998·Granted Jun 13, 2000·41 cites·10 claims
- 0664US5804422AProcess for producing a semiconductor packageSHINKO ELECTRIC IND CO·Filed 1996·Granted Sep 8, 1998·33 cites·9 claims
- 0764US5235209AMulti-layer lead frame for a semiconductor device with contact geometrySHINKO ELECTRIC IND CO·Filed 1991·Granted Aug 10, 1993·36 cites·10 claims
- 0861US5389816AMulti-layer lead frame using a metal-core substrateSHINKO ELECTRIC IND CO·Filed 1993·Granted Feb 14, 1995·29 cites·13 claims
- 0961US5281556AProcess for manufacturing a multi-layer lead frame having a ground plane and a power supply planeSHINKO ELECTRIC IND CO·Filed 1991·Granted Jan 25, 1994·32 cites·2 claims
- 1057US5576577AMulti-layer lead-frame for a semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1995·Granted Nov 19, 1996·26 cites·5 claims
- 1157US5231756AProcess for manufacturing a multi-layer lead frameSHINKO ELECTRIC IND CO·Filed 1992·Granted Aug 3, 1993·27 cites·12 claims
- 1250US5070390ASemiconductor device using a tape carrierSHINKO ELECTRIC IND CO·Filed 1990·Granted Dec 3, 1991·19 cites·5 claims
- 1337US2001028108A1Semiconductor device having external connecting terminals and process for manufacturing the deviceSHINKO ELECTRIC IND CO·Filed 2001·Application pending·0 cites
- 1436US5854094AProcess for manufacturing metal plane support for multi-layer lead framesSHINKO ELECTRIC IND CO·Filed 1996·Granted Dec 29, 1998·6 cites·6 claims
- 1532USRE35353EProcess for manufacturing a multi-layer lead frameSHINKO ELECTRIC IND CO·Filed 1994·Granted Oct 22, 1996·5 cites·12 claims
- 1629US2003107131A1Semiconductor device having external connecting terminals and process for manufacturing the deviceSHINKO ELECTRIC IND CO·Filed 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →