Inventor · disambiguated record
Mitsugu Shirai
Also filed as: SHIRAI MITSUGU
18 granted patents·352 citations·filing 1992–2002
95Inventor score
Files withHITACHI LTD18
Top patents by PatentIndex Score
18 records- 0195US6471115B1Process for manufacturing electronic circuit devicesHITACHI LTD·Filed 2000·Granted Oct 29, 2002·91 cites·4 claims
- 0290US6137687APrinted circuit board, IC card, and manufacturing method thereofHITACHI LTD·Filed 2000·Granted Oct 24, 2000·66 cites·7 claims
- 0367US5329160ASemiconductor package with metalized portionsHITACHI LTD·Filed 1992·Granted Jul 12, 1994·44 cites·5 claims
- 0466US6269998B1Process for manufacturing electronic circuitsHITACHI LTD·Filed 2000·Granted Aug 7, 2001·9 cites·8 claims
- 0565US5516031ASoldering method and apparatus for use in connecting electronic circuit devicesHITACHI LTD·Filed 1994·Granted May 14, 1996·34 cites·27 claims
- 0660US6161748AProcess for manufacturing electronic circuitsHITACHI LTD·Filed 2000·Granted Dec 19, 2000·6 cites·5 claims
- 0759US5551148AMethod for forming conductive bumpsHITACHI LTD·Filed 1994·Granted Sep 3, 1996·27 cites·2 claims
- 0857US6433810B1Laser printing method and apparatus for printing charactersHITACHI LTD·Filed 2000·Granted Aug 13, 2002·1 cites·18 claims
- 0957US5973406AElectronic device bonding method and electronic circuit apparatusHITACHI LTD·Filed 1997·Granted Oct 26, 1999·22 cites·6 claims
- 1057US5940728AProcess for manufacturing electronic circuitsHITACHI LTD·Filed 1996·Granted Aug 17, 1999·15 cites·21 claims
- 1156US6705505B2Paste providing method, soldering method and apparatus and system thereforHITACHI LTD·Filed 2002·Granted Mar 16, 2004·5 cites·20 claims
- 1250US6533162B2Paste providing method, soldering method and apparatus and system thereforHITACHI LTD·Filed 2000·Granted Mar 18, 2003·3 cites·9 claims
- 1349US6795105B2Laser printing method and apparatusHITACHI LTD·Filed 2002·Granted Sep 21, 2004·0 cites·28 claims
- 1447US6193144B1Paste providing method, soldering method and apparatus and system thereforHITACHI LTD·Filed 1998·Granted Feb 27, 2001·10 cites·10 claims
- 1546US6410881B2Process for manufacturing electronic circuitsHITACHI LTD·Filed 2001·Granted Jun 25, 2002·1 cites·12 claims
- 1644US6551449B2Thin electronic circuit component and method and apparatus for producing the sameHITACHI LTD·Filed 2001·Granted Apr 22, 2003·2 cites·5 claims
- 1742US6203655B1Thin electronic circuit component and method and apparatus for producing the sameHITACHI LTD·Filed 1998·Granted Mar 20, 2001·11 cites·10 claims
- 1839US6133135AProcess for manufacturing electronic circuitsHITACHI LTD·Filed 1999·Granted Oct 17, 2000·5 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →