Inventor · disambiguated record
Michael Arnett Smith
Also filed as: SMITH MICHAEL ARNETT
3 granted patents·2 pending applications·40 citations·filing 2007–2014
67Inventor score
Top patents by PatentIndex Score
5 records- 0191US9153863B2Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applicationsDU PONT·Filed 2013·Granted Oct 6, 2015·35 cites·16 claims
- 0276US9579748B2Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tapeDU PONT·Filed 2014·Granted Feb 28, 2017·3 cites·13 claims
- 0354US8742262B2Low temperature co-fired ceramic structure for high frequency applications and process for making sameGORDON SCOTT E·Filed 2012·Granted Jun 3, 2014·2 cites·24 claims
- 0449US2014353005A1Method of making microwave and millimeterwave electronic circuits by laser patterning of unfired low temperature co-fired ceramic (ltcc) substratesDU PONT·Filed 2014·Application pending·0 cites
- 0541US2011027539A1Improved process for pressureless constrained sintering of low temperature co-fired ceramic with surface circuit patternsDU PONT·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →