Inventor · disambiguated record
Michael James Solimando
Also filed as: SOLIMANDO MICHAEL JAMES
1 granted patent·1 pending application·10 citations·filing 2016–2017
32Inventor score
Technology areasH10W
Files withQUALCOMM INC2
Top patents by PatentIndex Score
2 records- 0187US10002857B2Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layerQUALCOMM INC·Filed 2016·Granted Jun 19, 2018·10 cites·34 claims
- 0233US2017271175A1Exposed die mold underfill (muf) with fine pitch copper (cu) pillar assembly and bump densityQUALCOMM INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →