Inventor · disambiguated record
Michael J. Steidl
Also filed as: STEIDL MICHAEL J
6 granted patents·516 citations·filing 1989–1996
87Inventor score
Technology areasH10W
Files withLSI LOGIC CORP6
Top patents by PatentIndex Score
6 records- 0195US5173766ASemiconductor device package and method of making such a packageLSI LOGIC CORP·Filed 1990·Granted Dec 22, 1992·342 cites·5 claims
- 0290US5023202ARigid strip carrier for integrated circuitsLSI LOGIC CORP·Filed 1989·Granted Jun 11, 1991·87 cites·28 claims
- 0361US5051813APlastic-packaged semiconductor device having lead support and alignment structureLSI LOGIC CORP·Filed 1990·Granted Sep 24, 1991·31 cites·4 claims
- 0459US5796171AProgressive staggered bonding padsLSI LOGIC CORP·Filed 1996·Granted Aug 18, 1998·29 cites·13 claims
- 0552US5814892ASemiconductor die with staggered bond padsLSI LOGIC CORP·Filed 1996·Granted Sep 29, 1998·19 cites·13 claims
- 0636US5104827AMethod of making a plastic-packaged semiconductor device having lead support and alignment structureLSI LOGIC CORP·Filed 1991·Granted Apr 14, 1992·8 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →