Inventor · disambiguated record
Mitsunari Sukekawa
Also filed as: SUKEKAWA MITSUNARI
44 granted patents·18 pending applications·209 citations·filing 1999–2024
97Inventor score
Top patents by PatentIndex Score
62 records- 0198US9666573B1Methods of forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2016·Granted May 30, 2017·49 cites·21 claims
- 0297US10103053B1Methods of forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 16, 2018·19 cites·21 claims
- 0396US11706909B2Integrated assemblies comprising memory cells and shielding material between the memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 18, 2023·3 cites·24 claims
- 0496US9245893B1Semiconductor constructions having grooves dividing active regionsMICRON TECHNOLOGY INC·Filed 2014·Granted Jan 26, 2016·26 cites·17 claims
- 0594US11171140B2Semiconductor memory device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 9, 2021·3 cites·19 claims
- 0693US10410912B2Integrated circuitryMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·6 cites·20 claims
- 0790US10861787B1Memory device with bitline noise suppressing schemeMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 8, 2020·6 cites·24 claims
- 0888US11844208B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 12, 2023·1 cites·5 claims
- 0988US11139302B2Integrated assemblies comprising spaces between bitlines and comprising conductive plates operationally proximate the bitlines, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 5, 2021·5 cites·26 claims
- 1088US10535710B2Methods of forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 14, 2020·3 cites·10 claims
- 1188US8541316B2Method of manufacturing semiconductor device including sequentially forming first and second mask material layers and forming a dotted photoresist pattern on the second mask material layerSUKEKAWA MITSUNARI·Filed 2011·Granted Sep 24, 2013·10 cites·7 claims
- 1287US10504961B2Methods of forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 10, 2019·3 cites·28 claims
- 1386US11917808B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 27, 2024·1 cites·14 claims
- 1482US8941162B2Semiconductor device, method for forming the same, and data processing systemSUKEKAWA MITSUNARI·Filed 2011·Granted Jan 27, 2015·7 cites·20 claims
- 1579US11217588B2Integrated assemblies comprising voids between active regions and conductive shield plates, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 4, 2022·2 cites·29 claims
- 1679US10910379B2Integrated assemblies comprising memory cells and shielding material between the memory cells, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 2, 2021·2 cites·11 claims
- 1778US10340261B1Semiconductor memory device having plural chips connected by hybrid bonding methodMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 2, 2019·2 cites·20 claims
- 1877US10867837B2Methods of forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 15, 2020·1 cites·10 claims
- 1977US10600772B2Semiconductor memory device having plural chips connected by hybrid bonding methodMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 24, 2020·3 cites·20 claims
- 2076US10868078B2Methods of forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 15, 2020·1 cites·7 claims
- 2172US8383511B2Method for manufacturing maskELPIDA MEMORY INC·Filed 2012·Granted Feb 26, 2013·2 cites·18 claims
- 2270US6309960B1Method of fabricating a semiconductor deviceNEC CORP·Filed 2000·Granted Oct 30, 2001·18 cites·11 claims
- 2369US10546811B2Assemblies which include wordlines over gate electrodesMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 28, 2020·1 cites·22 claims
- 2468US11917814B2Semiconductor deviceMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 27, 2024·0 cites·18 claims
- 2567US12495535B2Compact microelectronic 6T SRAM memory devices, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 2666US11744061B2Array of capacitors, an array of memory cells, a method of forming an array of capacitors, and a method of forming an array of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 29, 2023·0 cites·15 claims
- 2766US7741682B2Semiconductor integrated circuit device including a silicon layer formed on a diffusion layerELPIDA MEMORY INC·Filed 2006·Granted Jun 22, 2010·3 cites·16 claims
- 2866US6544840B2Semiconductor memory device and manufacturing method and mask data preparing method for the sameNEC CORP·Filed 2002·Granted Apr 8, 2003·9 cites·6 claims
- 2966US2025220889A1Methods of forming microelectronic devices utilizing directed self-assembly and related microelectronic devicesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3066US2025048618A1Microelectronic devices, and related methods, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3162US11785781B2Integrated circuit constructions comprising memory and methods used in the formation of integrated circuitry comprising memoryMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 10, 2023·0 cites·8 claims
- 3262US6469337B1Semiconductor memory device and manufacturing method and mask data preparing method for the sameNEC CORP·Filed 2000·Granted Oct 22, 2002·7 cites·10 claims
- 3361US11177266B2Array of capacitors, an array of memory cells, a method of forming an array of capacitors, and a method of forming an array of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 16, 2021·0 cites·24 claims
- 3459US2024170327A1Semiconductor device including hydrogen introduction layer provided on semiconductor substrate and method of forming the sameMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3558US12057317B2Conductive layers in memory array region and methods for forming the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 6, 2024·0 cites·21 claims
- 3658US8093642B2Semiconductor memory device and method of manufacturing the sameSUKEKAWA MITSUNARI·Filed 2009·Granted Jan 10, 2012·1 cites·9 claims
- 3757US11062989B2Assemblies which include wordlines over gate electrodesMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 13, 2021·0 cites·13 claims
- 3856US11569185B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 31, 2023·0 cites·19 claims
- 3955US2023397408A1Apparatuses including semiconductive pillar structures, and related methods, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4054US11488963B2Method of forming a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 4153US11961579B2Bit line noise suppression and related apparatuses, methods, and computing systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 4253US11049864B2Apparatuses including capacitor structures, and related memory devices, electronic systems, and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 29, 2021·0 cites·22 claims
- 4352US11037940B2Integrated circuit constructions comprising memory and methods used in the formation of integrated circuitry comprising memoryMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 15, 2021·0 cites·21 claims
- 4450US11031374B2Methods of compensating for misalignment of bonded semiconductor wafersMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 8, 2021·0 cites·38 claims
- 4549US6261949B1Method for manufacturing semiconductor deviceNEC CORP·Filed 1999·Granted Jul 17, 2001·15 cites·13 claims
- 4648US10818665B2Array of recessed access devices and an array of memory cells individually comprising a capacitor and a transistorMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 27, 2020·0 cites·27 claims
- 4748US8138094B2Method for manufacturing maskSUKEKAWA MITSUNARI·Filed 2010·Granted Mar 20, 2012·0 cites·10 claims
- 4848US2016035730A1Semiconductor devicePS4 LUXCO SARL·Filed 2015·Application pending·0 cites
- 4948US2009081879A1Method for manufacturing semiconductor deviceELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 5048US2013228837A1Semiconductor deviceELPIDA MEMORY INC·Filed 2013·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →