Inventor · disambiguated record
Ming-Chung Sung
Also filed as: SUNG MING-CHUNG
13 granted patents·2 pending applications·91 citations·filing 2001–2015
89Inventor score
Top patents by PatentIndex Score
15 records- 0195US8823180B2Package on package devices and methods of packaging semiconductor diesWANG TSUNG-DING·Filed 2012·Granted Sep 2, 2014·30 cites·18 claims
- 0295US7265034B2Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw bladeTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 4, 2007·33 cites·20 claims
- 0382US8652939B2Method and apparatus for die assemblySUNG MING-CHUNG·Filed 2011·Granted Feb 18, 2014·6 cites·14 claims
- 0480US7951647B2Performing die-to-wafer stacking by filling gaps between diesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted May 31, 2011·9 cites·20 claims
- 0576US9165876B2Package-on-package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 20, 2015·3 cites·20 claims
- 0672US7642631B2Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from waferTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 5, 2010·4 cites·20 claims
- 0766US8796132B2System and method for forming uniform rigid interconnect structuresSUNG MING-CHUNG·Filed 2012·Granted Aug 5, 2014·2 cites·20 claims
- 0865US9147584B2Rotating curingLU JING RUEI·Filed 2011·Granted Sep 29, 2015·2 cites·19 claims
- 0962US8664039B2Methods and apparatus for alignment in flip chip bondingSUNG MING-CHUNG·Filed 2011·Granted Mar 4, 2014·1 cites·17 claims
- 1057US7977155B2Wafer-level flip-chip assembly methodsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 12, 2011·1 cites·5 claims
- 1150US9985013B2Package-on-package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 29, 2018·0 cites·17 claims
- 1250US2002178121A1Method for secure online transactionFiled 2001·Application pending·0 cites
- 1343US8232183B2Process and apparatus for wafer-level flip-chip assemblyLEE CHIEN-HSIUN·Filed 2007·Granted Jul 31, 2012·0 cites·14 claims
- 1436US8927877B2Looped interconnect structureSHEN HSIN-AN·Filed 2012·Granted Jan 6, 2015·0 cites·20 claims
- 1526US2003071354A1Wafer level chip scale package and method of fabricating the sameFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ming-Chung Sung files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →