Inventor · disambiguated record
Mitsuru Taguchi
Also filed as: TAGUCHI MITSURU
24 granted patents·2 pending applications·605 citations·filing 1974–2010
97Inventor score
Top patents by PatentIndex Score
26 records- 0193US5063833AAir spout device for a ventilating arrangementNISSAN MOTOR·Filed 1989·Granted Nov 12, 1991·62 cites·20 claims
- 0286US6593246B1Process for producing semiconductor deviceSONY CORP·Filed 2000·Granted Jul 15, 2003·32 cites·11 claims
- 0382US6380065B1Interconnection structure and fabrication process thereforSONY CORP·Filed 1999·Granted Apr 30, 2002·69 cites·8 claims
- 0481US6361662B1Method for fabricating a semiconductor device in a magnetron sputtering systemSONY CORP·Filed 1997·Granted Mar 26, 2002·66 cites·2 claims
- 0581US6333258B1Method of manufacturing a semiconductor deviceSONY CORP·Filed 2000·Granted Dec 25, 2001·26 cites·14 claims
- 0678US5308793AMethod for forming interconnectorSONY CORP·Filed 1992·Granted May 3, 1994·59 cites·22 claims
- 0777US6709979B2Method of manufacturing a semiconductor deviceSONY CORP·Filed 2001·Granted Mar 23, 2004·21 cites·4 claims
- 0877US5137491AAir spout device for air conditioning system for use in automotive vehicleNISSAN MOTOR·Filed 1991·Granted Aug 11, 1992·40 cites·4 claims
- 0974US6878632B2Semiconductor device having a conductive layer with a cobalt tungsten phosphorus coating and a manufacturing method thereofSONY CORP·Filed 2001·Granted Apr 12, 2005·17 cites·5 claims
- 1072US6645852B1Process for fabricating a semiconductor device having recess portionSONY CORP·Filed 2000·Granted Nov 11, 2003·19 cites·6 claims
- 1167US5719446AMultilayer interconnect structure for semiconductor device and method of manufacturing sameSONY CORP·Filed 1997·Granted Feb 17, 1998·39 cites·7 claims
- 1264US6602787B2Method for fabricating semiconductor devicesSONY CORP·Filed 2001·Granted Aug 5, 2003·9 cites·12 claims
- 1361US5985747ASemiconductor device manufacturing methodSONY CORP·Filed 1997·Granted Nov 16, 1999·27 cites·9 claims
- 1460US6306761B1Method of manufacturing semiconductor deviceSONY CORP·Filed 1996·Granted Oct 23, 2001·25 cites·23 claims
- 1558US6736699B2Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishingSONY CORP·Filed 2001·Granted May 18, 2004·5 cites·7 claims
- 1657US6191031B1Process for producing multi-layer wiring structureSONY CORP·Filed 1999·Granted Feb 20, 2001·21 cites·8 claims
- 1757US5776830AProcess for fabricating connection structuresSONY CORP·Filed 1997·Granted Jul 7, 1998·22 cites·3 claims
- 1856US6465342B1Semiconductor device and its manufacturing methodSONY CORP·Filed 2000·Granted Oct 15, 2002·7 cites·13 claims
- 1948US9206531B2Iodine- and amylose-containing fibers, method for production thereof, and use thereofINOUE OSAMU·Filed 2010·Granted Dec 8, 2015·0 cites·18 claims
- 2048USRE40748EProcess for producing semiconductor deviceSONY CORP·Filed 2004·Granted Jun 16, 2009·1 cites·11 claims
- 2146US6268290B1Method of forming wiringsSONY CORP·Filed 1994·Granted Jul 31, 2001·15 cites·7 claims
- 2242US2004188273A1Electrolytic polishing apparatus, electrolytic polishing method, and wafer subject to polishingFiled 2004·Application pending·0 cites
- 2341US6197686B1Aluminum metallization by a barrier metal processSONY CORP·Filed 1993·Granted Mar 6, 2001·11 cites·4 claims
- 2440US6051490AMethod of forming wiringsSONY CORP·Filed 1997·Granted Apr 18, 2000·9 cites·8 claims
- 2535US2002074664A1Semiconductor device and manufacturing method thereofFiled 2001·Application pending·0 cites
- 2619US3992174ASpecimen capsule and process for gas chromatographyJAPAN ANALYTICAL INDUSTRY CO L·Filed 1974·Granted Nov 16, 1976·3 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →