Inventor · disambiguated record
Michimasa Takahashi
Also filed as: TAKAHASHI MICHIMASA
72 granted patents·14 pending applications·508 citations·filing 2005–2022
99Inventor score
Top patents by PatentIndex Score
86 records- 0196US8101868B2Multilayered printed circuit board and method for manufacturing the sameITO SOTARO·Filed 2006·Granted Jan 24, 2012·37 cites·32 claims
- 0296US7834273B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Nov 16, 2010·41 cites·41 claims
- 0395US8071883B2Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2007·Granted Dec 6, 2011·29 cites·24 claims
- 0495US7982135B2Flex-rigid wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 2007·Granted Jul 19, 2011·28 cites·24 claims
- 0595US7759582B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Jul 20, 2010·29 cites·31 claims
- 0695US7626829B2Multilayer printed wiring board and manufacturing method of the multilayer printed wiring boardIBIDEN CO LTD·Filed 2005·Granted Dec 1, 2009·36 cites·18 claims
- 0794US7957154B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2006·Granted Jun 7, 2011·26 cites·12 claims
- 0893US8658904B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Feb 25, 2014·18 cites·32 claims
- 0992US8359738B2Method of manufacturing wiring boardIBIDEN CO LTD·Filed 2011·Granted Jan 29, 2013·11 cites·16 claims
- 1092US8354596B2Multilayer wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2011·Granted Jan 15, 2013·11 cites·18 claims
- 1192US8035983B2Wiring board and method of manufacturing wiring boardIBIDEN CO LTD·Filed 2008·Granted Oct 11, 2011·18 cites·30 claims
- 1292US7929313B2Method of manufacturing multilayer printed circuit boardIBIDEN CO LTD·Filed 2009·Granted Apr 19, 2011·17 cites·2 claims
- 1391US8320135B2Multilayer printed circuit boardITO SOTARO·Filed 2011·Granted Nov 27, 2012·10 cites·8 claims
- 1491US8168893B2Multilayer wiring board with concave portion for accomodating electronic componentITO SOTARO·Filed 2008·Granted May 1, 2012·23 cites·9 claims
- 1589US9027238B2Multilayered printed circuit board and method for manufacturing the sameITO SOTARO·Filed 2011·Granted May 12, 2015·8 cites·3 claims
- 1687US8493747B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Jul 23, 2013·8 cites·39 claims
- 1787US8177577B2Printed wiring board having a substrate with higher conductor density inserted into a recess of another substrate with lower conductor densityTAKAHASHI MICHIMASA·Filed 2009·Granted May 15, 2012·14 cites·19 claims
- 1886US8479389B2Method of manufacturing a flex-rigid wiring boardTAKAHASHI MICHIMASA·Filed 2009·Granted Jul 9, 2013·10 cites·20 claims
- 1985US8609991B2Flex-rigid wiring board and method for manufacturing the sameTAKAHASHI MICHIMASA·Filed 2009·Granted Dec 17, 2013·10 cites·16 claims
- 2084US8692132B2Multilayered printed circuit board and method for manufacturing the sameITO SOTARO·Filed 2011·Granted Apr 8, 2014·5 cites·20 claims
- 2184US7973249B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2010·Granted Jul 5, 2011·6 cites·5 claims
- 2283US9370101B2Method for plug-in board replacement and method for manufacturing multi-piece boardIBIDEN CO LTD·Filed 2013·Granted Jun 14, 2016·5 cites·14 claims
- 2382US8536457B2Multilayer wiring board and method for manufacturing the sameTAKAHASHI MICHIMASA·Filed 2009·Granted Sep 17, 2013·8 cites·15 claims
- 2482US8405999B2Flexible wiring board and method of manufacturing sameTAKAHASHI MICHIMASA·Filed 2009·Granted Mar 26, 2013·8 cites·25 claims
- 2582US8353103B2Manufacturing method of multilayer printed wiring boardIBIDEN CO LTD·Filed 2009·Granted Jan 15, 2013·8 cites·4 claims
- 2682US8178789B2Wiring board and method of manufacturing wiring boardTAKAHASHI MICHIMASA·Filed 2008·Granted May 15, 2012·8 cites·34 claims
- 2781US9603238B2Combined wiring boardIBIDEN CO LTD·Filed 2013·Granted Mar 21, 2017·5 cites·20 claims
- 2880US8481424B2Multilayer printed wiring boardTAKAHASHI MICHIMASA·Filed 2011·Granted Jul 9, 2013·4 cites·20 claims
- 2980US8212363B2Multilayer printed wiring boardTAKAHASHI MICHIMASA·Filed 2010·Granted Jul 3, 2012·4 cites·20 claims
- 3079US9277650B2Combined wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Mar 1, 2016·3 cites·14 claims
- 3179US9277655B2Combined wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Mar 1, 2016·3 cites·15 claims
- 3279US8759687B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Jun 24, 2014·4 cites·44 claims
- 3379US8404978B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Mar 26, 2013·4 cites·28 claims
- 3478US9040837B2Wiring board and method for manufacturing the sameTAKAHASHI MICHIMASA·Filed 2012·Granted May 26, 2015·4 cites·24 claims
- 3578US8705248B2Multilayer printed circuit boardITO SOTARO·Filed 2012·Granted Apr 22, 2014·3 cites·9 claims
- 3677US8044306B2Wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 2008·Granted Oct 25, 2011·5 cites·29 claims
- 3776US9425137B2Wiring boardIBIDEN CO LTD·Filed 2014·Granted Aug 23, 2016·3 cites·16 claims
- 3876US8476531B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2011·Granted Jul 2, 2013·2 cites·10 claims
- 3975US9066439B2Wiring board and method for manufacturing the sameSEGAWA HIROSHI·Filed 2012·Granted Jun 23, 2015·5 cites·27 claims
- 4075US8431829B2Printed wiring board and method for manufacturing the sameTAKAHASHI MICHIMASA·Filed 2009·Granted Apr 30, 2013·5 cites·20 claims
- 4174US9717151B2Flex-rigid wiring boardIBIDEN CO LTD·Filed 2015·Granted Jul 25, 2017·2 cites·20 claims
- 4273US9635765B2Combined wiring board and method for manufacturing combined wiring boardIBIDEN CO LTD·Filed 2014·Granted Apr 25, 2017·2 cites·16 claims
- 4373US9480173B2Flex-rigid wiring board and method for manufacturing flex-rigid wiring boardIBIDEN CO LTD·Filed 2014·Granted Oct 25, 2016·2 cites·20 claims
- 4473US8973259B2Method for manufacturing a multilayered circuit boardITO SOTARO·Filed 2011·Granted Mar 10, 2015·2 cites·17 claims
- 4573US8933556B2Wiring boardNAGANUMA NOBUYUKI·Filed 2010·Granted Jan 13, 2015·3 cites·17 claims
- 4670US8569630B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Oct 29, 2013·2 cites·21 claims
- 4768US10004145B2Combined wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Jun 19, 2018·1 cites·20 claims
- 4866US8912451B2Multilayered printed circuit board and method for manufacturing the sameITO SOTARO·Filed 2012·Granted Dec 16, 2014·1 cites·14 claims
- 4965US8461459B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Jun 11, 2013·1 cites·32 claims
- 5065US7718901B2Electronic parts substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2007·Granted May 18, 2010·5 cites·2 claims
Showing the top 50 of 86 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →