Inventor · disambiguated record
Mika Tanaka
Also filed as: TANAKA MIKA
2 granted patents·8 pending applications·1 citations·filing 2009–2023
30Inventor score
Top patents by PatentIndex Score
10 records- 0173US12509615B2Substrate-conveying support tape and electronic apparatus/device production methodSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Dec 30, 2025·1 cites·16 claims
- 0246US2011106450A1Satellite navigation/dead-reckoning navigation integrated positioning deviceFURUNO ELECTRIC CO·Filed 2009·Application pending·0 cites
- 0346US2025326926A1Resin composition for molding, and electronic component deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0445US12509613B2Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic deviceRESONAC CORP·Filed 2019·Granted Dec 30, 2025·0 cites·20 claims
- 0542US2024034833A1Resin composition for molding and electronic component deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 0642US2025289951A1Resin composition for molding and electronic component deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0742US2025340732A1Molding resin composition and electronic component deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0835US2022289920A1Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing methodSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 0934US2020102454A1Resin composition and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 1030US2021061986A1Epoxy resin composition and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →