Inventor · disambiguated record
Mitsuru Tanikawa
Also filed as: TANIKAWA MITSURU
9 granted patents·10 pending applications·13 citations·filing 2004–2021
81Inventor score
Top patents by PatentIndex Score
19 records- 0175US10066118B2Inkjet adhesive, manufacturing method for semiconductor device, and electronic componentSEKISUI CHEMICAL CO LTD·Filed 2016·Granted Sep 4, 2018·2 cites·9 claims
- 0275US8084530B2Sealing agent for optical semiconductor element, and optical semiconductor elementTANIKAWA MITSURU·Filed 2008·Granted Dec 27, 2011·8 cites·10 claims
- 0372US12077677B2Method for manufacturing cured film, method for manufacturing electronic component, and electronic componentSEKISUI CHEMICAL CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·17 claims
- 0471US10961411B2Inkjet adhesive, manufacturing method for semiconductor device, and electronic componentSEKISUI CHEMICAL CO LTD·Filed 2018·Granted Mar 30, 2021·1 cites·17 claims
- 0566US10202519B2Inkjet adhesive, manufacturing method for semiconductor device, and electronic componentSEKISUI CHEMICAL CO LTD·Filed 2016·Granted Feb 12, 2019·1 cites·17 claims
- 0657US11220604B2Method for manufacturing cured film, method for manufacturing electronic component, and electronic componentSEKISUI CHEMICAL CO LTD·Filed 2014·Granted Jan 11, 2022·0 cites·17 claims
- 0757US2009093562A1Curing resin composition, sealing material for liquid crystal display device and liquid crystal display deviceSEKISUI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 0857US2009134358A1Curing resin composition, sealing material for liquid crystal display device and liquid crystal display deviceSEKISUI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 0952US8519429B2Encapsulant for optical semiconductor device and optical semiconductor device using sameTANIKAWA MITSURU·Filed 2011·Granted Aug 27, 2013·1 cites·16 claims
- 1045US9337019B2Method for manufacturing electronic component, and electronic componentSEKISUI CHEMICAL CO LTD·Filed 2014·Granted May 10, 2016·0 cites·16 claims
- 1143US10259773B2Curable composition for inkjet, and method for manufacturing electronic componentSEKISUI CHEMICAL CO LTD·Filed 2016·Granted Apr 16, 2019·0 cites·16 claims
- 1243US2009091045A1Themosetting Composition for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for Optical Semiconductor Device, and Optical Semiconductor DeviceSEKISUI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 1342US2013094186A1Surface-treated fluorescent bodies and process for production of surface-treated fluorescent bodiesSUN REN-DE·Filed 2011·Application pending·0 cites
- 1434US2009061117A1Sealant for one drop fill process, vertically conducting material and liquid crystal display deviceOYAMA YUICHI·Filed 2006·Application pending·0 cites
- 1534US2006240198A1Curing resin composition, sealing material for liquid crystal display device and liquid crystal display deviceSEKISUI CHEMICAL CO LTD·Filed 2004·Application pending·0 cites
- 1634US2014175505A1Sealing agent for optical semiconductor devices, and optical semiconductor deviceYAMAZAKI RYOSUKE·Filed 2012·Application pending·0 cites
- 1733US2017158922A1Inkjet photo- and heat-curable adhesive, semiconductor device manufacturing method, and electronic partSEKISUI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
- 1833US2013221400A1Encapsulating agent for optical semiconductor devices, and optical semiconductor device using sameTANIKAWA MITSURU·Filed 2011·Application pending·0 cites
- 1930US2012126282A1Sealant for optical semiconductors and optical semiconductor deviceTANIKAWA MITSURU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →