Inventor · disambiguated record
Miyoshi Togawa
Also filed as: TOGAWA MIYOSHI
7 granted patents·16 citations·filing 1997–2018
76Inventor score
Top patents by PatentIndex Score
7 records- 0164US11211300B2Electronic component and camera moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Dec 28, 2021·1 cites·15 claims
- 0251US7129578B2Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main bodySONY CORP·Filed 2002·Granted Oct 31, 2006·7 cites·6 claims
- 0346US10917550B2Electronic component, camera module, and method for manufacturing electronic componentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Feb 9, 2021·0 cites·18 claims
- 0445US11356584B2Camera module, production method, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Jun 7, 2022·0 cites·9 claims
- 0544US10720459B2Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficientsSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Jul 21, 2020·0 cites·12 claims
- 0638US11178759B2Electronic component and camera moduleSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Nov 16, 2021·0 cites·10 claims
- 0735US6121686ABall grid array package having through-holes disposed in the substrate under the chipSONY CORP·Filed 1997·Granted Sep 19, 2000·8 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →