Inventor · disambiguated record
Mitsuo Togawa
Also filed as: TOGAWA MITSUO
1 granted patent·1 pending application·18 citations·filing 1998–2017
39Inventor score
Files withHITACHI CHEMICAL CO LTD2
Top patents by PatentIndex Score
2 records- 0144US6005030AEpoxy resin composition for semiconductor sealing and resin molded type semiconductor device sealed with the epoxy resin compositionHITACHI CHEMICAL CO LTD·Filed 1998·Granted Dec 21, 1999·18 cites·12 claims
- 0235US2020163221A1Circuit board production method, circuit sheet and circuit boardHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →