Inventor · disambiguated record
Michael Shou-Ming Tong
Also filed as: TONG MICHAEL SHOU-MING
3 granted patents·9 citations·filing 2010–2013
63Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0179US8963328B2Reducing delamination between an underfill and a buffer layer in a bond structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 24, 2015·4 cites·19 claims
- 0269US9117831B2Seal ring structure for integrated circuit chipsYANG CHING-JUNG·Filed 2011·Granted Aug 25, 2015·3 cites·19 claims
- 0367US8610267B2Reducing delamination between an underfill and a buffer layer in a bond structureYANG CHING-JUNG·Filed 2010·Granted Dec 17, 2013·2 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →