Inventor · disambiguated record
Minoru Torihata
Also filed as: TORIHATA MINORU
26 granted patents·352 citations·filing 1989–2002
97Inventor score
Top patents by PatentIndex Score
26 records- 0173US5562396ANon-contact type moving tableSHINKAWA KK·Filed 1995·Granted Oct 8, 1996·32 cites·1 claims
- 0267US5746422AClamping deviceSHINKAWA KK·Filed 1996·Granted May 5, 1998·35 cites·2 claims
- 0362US5439341ANon-contact type moving tableSHINKAWA KK·Filed 1993·Granted Aug 8, 1995·23 cites·2 claims
- 0460US5884830ACapillary for a wire bonding apparatusSHINKAWA KK·Filed 1997·Granted Mar 23, 1999·24 cites·7 claims
- 0559US5906308ACapillary for use in a wire bonding apparatusSHINKAWA KK·Filed 1997·Granted May 25, 1999·23 cites·3 claims
- 0657US5988481ABonding apparatus with adjustable heating blocks, clamps, and railsSHINKAWA KK·Filed 1998·Granted Nov 23, 1999·21 cites·3 claims
- 0757US5435477AWire clampersSHINKAWA KK·Filed 1994·Granted Jul 25, 1995·27 cites·3 claims
- 0856US6036080AWire bonding methodSHINKAWA KK·Filed 1998·Granted Mar 14, 2000·20 cites·4 claims
- 0956US5323948AWire clamperSHINKAWA KK·Filed 1993·Granted Jun 28, 1994·24 cites·4 claims
- 1051US6727666B2XY table for a semiconductor manufacturing apparatusSHINKAWA KK·Filed 2002·Granted Apr 27, 2004·5 cites·3 claims
- 1148US5562395ANon-contact type moving tableSHINKAWA KK·Filed 1995·Granted Oct 8, 1996·10 cites·1 claims
- 1246US5275324AWire bonding apparatusSHINKAWA KK·Filed 1993·Granted Jan 4, 1994·16 cites·4 claims
- 1345US6325269B1Wire bonding capillaryTOTO LTD·Filed 1998·Granted Dec 4, 2001·16 cites·13 claims
- 1443US5501569ANon-contact type moving tableSHINKAWA KK·Filed 1995·Granted Mar 26, 1996·7 cites·1 claims
- 1541US6145651AGuide rail mechanism for a bonding apparatusSHINKAWA KK·Filed 1999·Granted Nov 14, 2000·9 cites·6 claims
- 1641US5259548AWire bonding methodSHINKAWA KK·Filed 1992·Granted Nov 9, 1993·11 cites·2 claims
- 1740US6135270AGuide rail mechanism for a bonding apparatusSHINKAWA KK·Filed 1999·Granted Oct 24, 2000·9 cites·2 claims
- 1839US5564616AWire bonding apparatusSHINKAWA KK·Filed 1995·Granted Oct 15, 1996·8 cites·4 claims
- 1939US5431527ANon-contact type moving table systemSHINKAWA KK·Filed 1993·Granted Jul 11, 1995·8 cites·1 claims
- 2035US5234155AWire bonding method and apparatusSHINKAWA KK·Filed 1992·Granted Aug 10, 1993·6 cites·2 claims
- 2134US6089439AWire cutting and feeding device for use in wire bonding apparatusSHINKAWA KK·Filed 1997·Granted Jul 18, 2000·5 cites·4 claims
- 2234US5340010ABonding apparatusSHINKAWA KK·Filed 1992·Granted Aug 23, 1994·5 cites·2 claims
- 2333US5046655ADevice for detecting height of bonding surfaceSHINKAWA KK·Filed 1989·Granted Sep 10, 1991·4 cites·1 claims
- 2432US5157985AX-Y table for bonding devicesSHINKAWA KK·Filed 1991·Granted Oct 27, 1992·4 cites·1 claims
- 2530US5261777APushing deviceSHINKAWA KK·Filed 1992·Granted Nov 16, 1993·0 cites·2 claims
- 2624US6024271AWire bonding apparatusSHINKAWA KK·Filed 1997·Granted Feb 15, 2000·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →