Inventor · disambiguated record
Minh Quoc Tran
Also filed as: TRAN MINH · TRAN MINH Q · TRAN MINH QUOC
34 granted patents·3 pending applications·505 citations·filing 2000–2023
97Inventor score
Files withADVANCED MICRO DEVICES INC26SPANSION LLC4TRAN MINH Q2ADVANCED MICRO DEVICES INC AND SPANSION LLC1CYPRESS SEMICONDUCTOR CORP1
Top patents by PatentIndex Score
37 records- 0194US6518167B1Method of forming a metal or metal nitride interface layer between silicon nitride and copperADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 11, 2003·81 cites·20 claims
- 0293US7776682B1Ordered porosity to direct memory element formationSPANSION LLC·Filed 2005·Granted Aug 17, 2010·32 cites·20 claims
- 0391US7129133B1Method and structure of memory element plug with conductive Ta removed from sidewall at region of memory element filmSPANSION LLC·Filed 2004·Granted Oct 31, 2006·60 cites·22 claims
- 0491US6609946B1Method and system for polishing a semiconductor waferADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 26, 2003·41 cites·15 claims
- 0591US6566248B1Graphoepitaxial conductor cores in integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted May 20, 2003·72 cites·20 claims
- 0686US7534732B1Semiconductor devices with copper interconnects and composite silicon nitride capping layersSPANSION LLC·Filed 2006·Granted May 19, 2009·12 cites·7 claims
- 0784US8415256B1Gap-filling with uniform propertiesNICKEL ALEXANDER·Filed 2010·Granted Apr 9, 2013·9 cites·14 claims
- 0884US6664187B1Laser thermal annealing for Cu seedlayer enhancementADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 16, 2003·36 cites·20 claims
- 0980US6998337B1Thermal annealing for Cu seed layer enhancementADVANCED MICRO DEVICES INC·Filed 2003·Granted Feb 14, 2006·23 cites·18 claims
- 1078US7256499B1Ultra low dielectric constant integrated circuit systemADVANCED MICRO DEVICES INC·Filed 2005·Granted Aug 14, 2007·8 cites·20 claims
- 1177US7884030B1Gap-filling with uniform propertiesADVANCED MICRO DEVICES INC AND SPANSION LLC·Filed 2006·Granted Feb 8, 2011·7 cites·14 claims
- 1275US8735960B2High ultraviolet light absorbance silicon oxynitride film for improved flash memory device performanceTRAN MINH Q·Filed 2008·Granted May 27, 2014·8 cites·16 claims
- 1371US6425991B1Plating system with secondary ring anode for a semiconductor waferADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 30, 2002·14 cites·12 claims
- 1469US6402909B1Plating system with shielded secondary anode for semiconductor manufacturingADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 11, 2002·5 cites·12 claims
- 1568US6589408B1Non-planar copper alloy target for plasma vapor deposition systemsADVANCED MICRO DEVICES INC·Filed 2002·Granted Jul 8, 2003·8 cites·20 claims
- 1667US7208418B1Sealing sidewall pores in low-k dielectricsADVANCED MICRO DEVICES INC·Filed 2003·Granted Apr 24, 2007·13 cites·9 claims
- 1766US6541286B1Imaging of integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 1, 2003·12 cites·14 claims
- 1864US6992004B1Implanted barrier layer to improve line reliability and method of forming sameADVANCED MICRO DEVICES INC·Filed 2002·Granted Jan 31, 2006·11 cites·29 claims
- 1964US6979642B1Method of self-annealing conductive lines that separates grain size effects from alloy mobilityADVANCED MICRO DEVICES INC·Filed 2003·Granted Dec 27, 2005·8 cites·23 claims
- 2062US2025354061A1Lead-free ytterbium-doped double perovskite thin filmsUNIV NEW YORK·Filed 2023·Application pending·0 cites
- 2161US8026169B2Cu annealing for improved data retention in flash memory devicesADVANCED MICRO DEVICES INC·Filed 2006·Granted Sep 27, 2011·2 cites·6 claims
- 2261US6348732B1Amorphized barrier layer for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 19, 2002·8 cites·10 claims
- 2359US6649034B1Electro-chemical metal alloying for semiconductor manufacturingADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 18, 2003·2 cites·20 claims
- 2459US6583051B2Method of manufacturing an amorphized barrier layer for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Jun 24, 2003·7 cites·10 claims
- 2555US6756300B1Method for forming dual damascene interconnect structureADVANCED MICRO DEVICES INC·Filed 2002·Granted Jun 29, 2004·6 cites·15 claims
- 2653US6501177B1Atomic layer barrier layer for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 31, 2002·5 cites·10 claims
- 2753US6413390B1Plating system with remote secondary anode for semiconductor manufacturingADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 2, 2002·4 cites·12 claims
- 2851US7169706B2Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper depositionADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 30, 2007·4 cites·20 claims
- 2951US6455413B1Pre-fill CMP and electroplating method for integrated circuitsADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 24, 2002·3 cites·16 claims
- 3050US7001840B1Interconnect with multiple layers of conductive material with grain boundary between the layersADVANCED MICRO DEVICES INC·Filed 2003·Granted Feb 21, 2006·2 cites·14 claims
- 3149US9425325B2Electrically programmable and eraseable memory deviceCYPRESS SEMICONDUCTOR CORP·Filed 2014·Granted Aug 23, 2016·0 cites·8 claims
- 3247US8633074B2Electrically programmable and erasable memory device and method of fabrication thereofTRAN MINH Q·Filed 2008·Granted Jan 21, 2014·0 cites·16 claims
- 3345US7199416B1Systems and methods for a memory and/or selection element formed within a recess in a metal lineSPANSION LLC·Filed 2004·Granted Apr 3, 2007·2 cites·17 claims
- 3442US2008096364A1Conformal liner for gap-fillingADVANCED MICRO DEVICES INC·Filed 2006·Application pending·0 cites
- 3540US8202810B2Low-H plasma treatment with N2 anneal for electronic memory devicesNICKEL ALEXANDER H·Filed 2008·Granted Jun 19, 2012·0 cites·9 claims
- 3636US6504251B1Heat/cold amorphized barrier layer for integrated circuit interconnectsADVANCED MICRO DEVICES INC·Filed 2000·Granted Jan 7, 2003·0 cites·12 claims
- 3736US2002106905A1Method for removing copper from a wafer edgeADVANCED MICRO DEVICES INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →