Inventor · disambiguated record
Ming Hung Tseng
Also filed as: TSENG MING HUNG
92 granted patents·21 pending applications·301 citations·filing 2004–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD97TAIWAN SEMICONDUCTOR MFG10LIU TZUAN-HORNG2CHEN YU-REN1PAN KUO LUNG1
Top patents by PatentIndex Score
113 records- 0199US10269773B1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·45 cites·20 claims
- 0298US11410932B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·5 cites·20 claims
- 0397US11682655B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·3 cites·20 claims
- 0497US11664325B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 30, 2023·3 cites·20 claims
- 0597US11244906B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·5 cites·15 claims
- 0697US11227837B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 18, 2022·5 cites·20 claims
- 0796US11251119B2Package structure, package-on-package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 0896US9761522B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 12, 2017·19 cites·20 claims
- 0995US11848288B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·20 claims
- 1094US10790244B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·8 cites·21 claims
- 1194US10163780B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·9 cites·20 claims
- 1294US9117825B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 25, 2015·12 cites·19 claims
- 1394US8889484B2Apparatus and method for a component packageTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 18, 2014·16 cites·20 claims
- 1493US10115685B2Method of manufacturing a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 30, 2018·6 cites·20 claims
- 1593US10074472B2InFO coil on metal plate with slotTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 11, 2018·8 cites·20 claims
- 1692US10784223B2Elongated bump structures in package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 22, 2020·7 cites·20 claims
- 1791US11502039B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 1891US9355933B2Cooling channels in 3DIC stacksTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·9 cites·20 claims
- 1991US9059107B2Packaging methods and packaged devicesPAN KUO LUNG·Filed 2012·Granted Jun 16, 2015·21 cites·20 claims
- 2090US10497646B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 3, 2019·5 cites·20 claims
- 2190US9953936B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·5 cites·14 claims
- 2290US8916969B2Semiconductor devices, packaging methods and structuresCHEN YU-REN·Filed 2011·Granted Dec 23, 2014·14 cites·15 claims
- 2389US10784203B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·5 cites·20 claims
- 2488US10530175B2Hexagonal semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 7, 2020·2 cites·18 claims
- 2588US9406629B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·8 cites·12 claims
- 2688US9093440B2Connector structures of integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 28, 2015·6 cites·20 claims
- 2787US12374627B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 2887US11942433B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·1 cites·20 claims
- 2987US8193639B2Dummy metal design for packaging structuresLIU TZUAN-HORNG·Filed 2010·Granted Jun 5, 2012·8 cites·20 claims
- 3086US12261092B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·1 cites·20 claims
- 3185US12288729B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 29, 2025·0 cites·20 claims
- 3285US10128203B2Fan-out package structure, antenna system and associated methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·4 cites·18 claims
- 3384US2025323148A1Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3483US12362329B2Method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 3583US10950519B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
- 3683US9741589B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 22, 2017·3 cites·20 claims
- 3783US2024312692A1Coil structure and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3883US2025309122A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3982US12322696B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 4082US11075176B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·2 cites·20 claims
- 4182US10971477B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·2 cites·19 claims
- 4282US10304614B2Stacked coil for wireless charging structure on InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 28, 2019·2 cites·20 claims
- 4382US9991218B2Connector structures of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 5, 2018·2 cites·20 claims
- 4481US12266639B2Method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 4581US11935804B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 19, 2024·0 cites·20 claims
- 4681US10847304B2InFO coil on metal plate with slotTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·2 cites·20 claims
- 4781US10720388B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·2 cites·20 claims
- 4880US12040283B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 4980US11996227B2Hexagonal semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 5079US9053990B2Bump interconnection techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Jun 9, 2015·5 cites·12 claims
Showing the top 50 of 113 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →