Inventor · disambiguated record
Ming-Jen Tzou
Also filed as: TZOU MING-JEN
15 granted patents·5 pending applications·63 citations·filing 1996–2023
90Inventor score
Top patents by PatentIndex Score
20 records- 0183US8957326B2Composite dual blackened copper foil and method of manufacturing the sameNANYA PLASTICS CORP·Filed 2013·Granted Feb 17, 2015·4 cites·11 claims
- 0283US7745515B2Composition of dihydrobenzoxazine resin, epoxy resin(s), novolac resin and curing promoterNANYA PLASTICS CORP·Filed 2006·Granted Jun 29, 2010·6 cites·18 claims
- 0382US12199234B2Method for producing an electrolytic copper foilNAN YA PLASTICS CORP·Filed 2023·Granted Jan 14, 2025·0 cites·5 claims
- 0482US12199235B2Lithium ion secondary batteryNAN YA PLASTICS CORP·Filed 2023·Granted Jan 14, 2025·0 cites·6 claims
- 0580US8114508B2Composition of modified maleic anhydride and epdxy resinTZOU MING JEN·Filed 2009·Granted Feb 14, 2012·4 cites·9 claims
- 0677US8536283B2Varnish composition with high glass transition temperature for glass fiber laminateTZOU MING-JEN·Filed 2011·Granted Sep 17, 2013·2 cites·4 claims
- 0776US9258900B2Copper foil structure having blackened ultra-thin foil and manufacturing method thereofNANYA PLASTICS CORP·Filed 2014·Granted Feb 9, 2016·1 cites·5 claims
- 0875US9078353B2Copper foil structure having blackened ultra-thin foil and manufacturing method thereofNANYA PLASTICS CORP·Filed 2013·Granted Jul 7, 2015·3 cites·6 claims
- 0975US8329315B2Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing methodTZOU MING JEN·Filed 2011·Granted Dec 11, 2012·2 cites·3 claims
- 1072US11588175B2Electrolytic copper foilNANYA PLASTICS CORP·Filed 2020·Granted Feb 21, 2023·0 cites·7 claims
- 1169US5858618APhotopolymerizable resinous compositionNANYA PLASTICS CORP·Filed 1996·Granted Jan 12, 1999·33 cites·12 claims
- 1268US6512075B1High Tg brominated epoxy resin for glass fiber laminateNANYA PLASTICS CORP·Filed 2001·Granted Jan 28, 2003·8 cites·5 claims
- 1351US2008132131A1Polybutadiene thermosetting resin printed circuit board composition and the process thereofNANYA PLASTICS CORP·Filed 2006·Application pending·0 cites
- 1446US8039560B1Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereofNANYA PLASTICS CORP·Filed 2010·Granted Oct 18, 2011·0 cites·8 claims
- 1543US2010311916A1Electric circuit board composition and a method of preparing circuit boardTZOU MING JEN·Filed 2009·Application pending·0 cites
- 1641US9115441B2Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boardsTZOU MING JEN·Filed 2011·Granted Aug 25, 2015·0 cites·4 claims
- 1740US2011315435A1Acid anhydride curable thermosetting resin compositionTZOU MING JEN·Filed 2010·Application pending·0 cites
- 1840US2011082239A1Thermosetting epoxy composition with low expansibilityNANYA PLASTICS CORP·Filed 2010·Application pending·0 cites
- 1936US8362116B2Low dielectric resin varnish composition for laminates and the preparation thereofNANYA PLASTICS CORP·Filed 2010·Granted Jan 29, 2013·0 cites·14 claims
- 2036US2003129535A1Photosensitive thermosetting resin compositionFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →