Inventor · disambiguated record
Michitaka Urushima
Also filed as: URUSHIMA MICHITAKA
12 granted patents·1 pending application·716 citations·filing 1992–2002
93Inventor score
Top patents by PatentIndex Score
13 records- 0196US6791195B2Semiconductor device and manufacturing method of the sameNEC ELECTRONICS CORP·Filed 2001·Granted Sep 14, 2004·132 cites·9 claims
- 0296US5474957AProcess of mounting tape automated bonded semiconductor chip on printed circuit board through bumpsNEC CORP·Filed 1995·Granted Dec 12, 1995·291 cites·14 claims
- 0388US6372549B2Semiconductor package and semiconductor package fabrication methodNEC CORP·Filed 2001·Granted Apr 16, 2002·49 cites·11 claims
- 0482US5350947AFilm carrier semiconductor deviceNEC CORP·Filed 1992·Granted Sep 27, 1994·81 cites·11 claims
- 0580US5869887ASemiconductor package fabricated by using automated bonding tapeNEC CORP·Filed 1995·Granted Feb 9, 1999·65 cites·11 claims
- 0665US6046495ASemiconductor device having a tab tape and a ground layerNEC CORP·Filed 1997·Granted Apr 4, 2000·32 cites·16 claims
- 0760US5686757AFilm carrier tape for use in tape automated bondingNEC CORP·Filed 1994·Granted Nov 11, 1997·28 cites·7 claims
- 0850US5503321ABonding tool employed in ultrasonic compression bonding apparatusNEC CORP·Filed 1994·Granted Apr 2, 1996·18 cites·20 claims
- 0949US6515357B2Semiconductor package and semiconductor package fabrication methodNEC CORP·Filed 2002·Granted Feb 4, 2003·3 cites·6 claims
- 1039US5743459AMethod for fabricating semiconductor device with step of bonding lead frame leads to chip padsNEC CORP·Filed 1995·Granted Apr 28, 1998·8 cites·3 claims
- 1139US2002132463A1Semiconductor device and manufacturing method of the sameFiled 2002·Application pending·0 cites
- 1236US5662263ASingle point bonding methodNEC CORP·Filed 1995·Granted Sep 2, 1997·6 cites·12 claims
- 1332US6173884B1Semiconductor device and equipment for manufacturing the same as well as method of fabricating the sameNEC CORP·Filed 1999·Granted Jan 16, 2001·3 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →