Inventor · disambiguated record
Michael B. Vincent
Also filed as: VINCENT MICHAEL · VINCENT MICHAEL B · VINCENT MICHAEL C
87 granted patents·24 pending applications·434 citations·filing 2001–2024
99Inventor score
Top patents by PatentIndex Score
111 records- 0198US9698104B2Integrated electronic package and stacked assembly thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Jul 4, 2017·37 cites·15 claims
- 0298US9396999B2Wafer level packaging methodFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jul 19, 2016·46 cites·11 claims
- 0397US9299670B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted Mar 29, 2016·39 cites·20 claims
- 0495US11404288B1Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Aug 2, 2022·3 cites·20 claims
- 0594US9761565B2Microelectronic packages having embedded sidewall substrates and methods for the producing thereofNXP USA INC·Filed 2017·Granted Sep 12, 2017·10 cites·19 claims
- 0694US9673150B2EMI/RFI shielding for semiconductor device packagesGONG ZHIWEI·Filed 2014·Granted Jun 6, 2017·18 cites·18 claims
- 0793US11791283B2Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Oct 17, 2023·2 cites·16 claims
- 0893US11631625B2Topside heatsinking antenna launcher for an integrated circuit packageNXP USA INC·Filed 2022·Granted Apr 18, 2023·2 cites·20 claims
- 0993US9826630B2Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2014·Granted Nov 21, 2017·15 cites·14 claims
- 1092US11557525B2Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elementsNXP USA INC·Filed 2021·Granted Jan 17, 2023·3 cites·11 claims
- 1192US9595485B2Microelectronic packages having embedded sidewall substrates and methods for the producing thereofVINCENT MICHAEL B·Filed 2014·Granted Mar 14, 2017·11 cites·17 claims
- 1292US9111870B2Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2013·Granted Aug 18, 2015·13 cites·20 claims
- 1391US11133273B2Semiconductor device with waveguide and method thereforNXP USA INC·Filed 2019·Granted Sep 28, 2021·7 cites·11 claims
- 1491US9355985B2Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2014·Granted May 31, 2016·12 cites·20 claims
- 1590US11777204B2PackageNXP BV·Filed 2021·Granted Oct 3, 2023·2 cites·20 claims
- 1690US10074614B2EMI/RFI shielding for semiconductor device packagesNXP USA INC·Filed 2017·Granted Sep 11, 2018·6 cites·19 claims
- 1789US10440819B2Fan-out wafer level packages having preformed embedded ground plane connectionsNXP USA INC·Filed 2017·Granted Oct 8, 2019·5 cites·19 claims
- 1889US9331029B2Microelectronic packages having mold-embedded traces and methods for the production thereofVINCENT MICHAEL B·Filed 2014·Granted May 3, 2016·11 cites·20 claims
- 1988US11031681B2Package integrated waveguideNXP USA INC·Filed 2019·Granted Jun 8, 2021·6 cites·20 claims
- 2087US12243842B2Semiconductor device with open cavity and method thereforNXP USA INC·Filed 2021·Granted Mar 4, 2025·1 cites·7 claims
- 2187US9093457B2Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereofGONG ZHIWEI·Filed 2012·Granted Jul 28, 2015·10 cites·13 claims
- 2285US12288927B2Semiconductor device with low loss waveguide interface and method thereforNXP USA INC·Filed 2021·Granted Apr 29, 2025·1 cites·20 claims
- 2384US9036363B2Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabricationVINCENT MICHAEL B·Filed 2013·Granted May 19, 2015·7 cites·17 claims
- 2483US9899298B2Microelectronic packages having mold-embedded traces and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Feb 20, 2018·1 cites·20 claims
- 2583US9263420B2Devices and stacked microelectronic packages with package surface conductors and methods of their fabricationVINCENT MICHAEL B·Filed 2013·Granted Feb 16, 2016·5 cites·14 claims
- 2683US6739497B2SMT passive device noflow underfill methodology and structureIBM·Filed 2002·Granted May 25, 2004·31 cites·17 claims
- 2782US9761570B1Electronic component package with multple electronic componentsFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Sep 12, 2017·4 cites·22 claims
- 2881US9190390B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofGONG ZHIWEI TONY·Filed 2012·Granted Nov 17, 2015·8 cites·20 claims
- 2981US7196526B2Matched delay line voltage converterUNIV COLORADO REGENTS·Filed 2005·Granted Mar 27, 2007·11 cites·24 claims
- 3078US11532532B2Composite media protection for pressure sensorNXP USA INC·Filed 2019·Granted Dec 20, 2022·2 cites·20 claims
- 3178US6958721B2Matched delay line voltage converterUNIV COLORADO·Filed 2003·Granted Oct 25, 2005·17 cites·20 claims
- 3277US6674172B2Flip-chip package with underfill having low density fillerIBM·Filed 2001·Granted Jan 6, 2004·21 cites·11 claims
- 3376US11760623B2No-gel pressure sensor packageNXP USA INC·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 3476US2025029947A1Semiconductor device with open cavity and method thereforNXP USA INC·Filed 2024·Application pending·0 cites
- 3576US2025006511A1Semiconductor device packaging warpage controlNXP USA INC·Filed 2024·Application pending·0 cites
- 3675US10658303B1High aspect ratio connection for EMI shieldingNXP USA INC·Filed 2018·Granted May 19, 2020·2 cites·20 claims
- 3775US9799636B2Packaged devices with multiple planes of embedded electronic devicesFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 24, 2017·2 cites·7 claims
- 3875US9502363B2Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layersVINCENT MICHAEL B·Filed 2014·Granted Nov 22, 2016·4 cites·16 claims
- 3975US9025340B2Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabricationWRIGHT JASON R·Filed 2013·Granted May 5, 2015·5 cites·4 claims
- 4074US9305911B2Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabricationVINCENT MICHAEL B·Filed 2013·Granted Apr 5, 2016·3 cites·20 claims
- 4174US7408264B2SMT passive device noflow underfill methodology and structureIBM·Filed 2006·Granted Aug 5, 2008·5 cites·4 claims
- 4274US6815258B2Flip-chip package with underfill having low density fillerIBM·Filed 2003·Granted Nov 9, 2004·18 cites·27 claims
- 4372US11127645B2Grounding lids in integrated circuit devicesNXP USA INC·Filed 2019·Granted Sep 21, 2021·1 cites·20 claims
- 4472US10529670B2Shielded package with integrated antennaNXP USA INC·Filed 2019·Granted Jan 7, 2020·1 cites·18 claims
- 4571US10834817B2Plated opening with vent pathNXP USA INC·Filed 2018·Granted Nov 10, 2020·1 cites·9 claims
- 4671US2023369248A1Semiconductor device packaging warpage controlNXP USA INC·Filed 2023·Application pending·0 cites
- 4770US11935809B2Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elementsNXP USA INC·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 4869US11335652B2Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguideNXP USA INC·Filed 2019·Granted May 17, 2022·1 cites·20 claims
- 4969US11276654B2Bottom-side heatsinking waveguide for an integrated circuit packageNXP USA INC·Filed 2019·Granted Mar 15, 2022·1 cites·20 claims
- 5068US12033950B2Semiconductor device with self-aligned waveguide and method thereforNXP USA INC·Filed 2021·Granted Jul 9, 2024·0 cites·13 claims
Showing the top 50 of 111 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →