Inventor · disambiguated record
Miyuki Wakao
Also filed as: WAKAO MIYUKI
21 granted patents·2 pending applications·305 citations·filing 1993–2016
95Inventor score
Top patents by PatentIndex Score
23 records- 0194US9660157B2Addition-curable silicone resin composition and die attach material for optical semiconductor deviceSHINETSU CHEMICAL CO·Filed 2016·Granted May 23, 2017·4 cites·8 claims
- 0290US6376923B1Flip-chip type semiconductor device sealing material and flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Apr 23, 2002·38 cites·17 claims
- 0388US6225704B1Flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted May 1, 2001·55 cites·2 claims
- 0486US6512031B1Epoxy resin composition, laminate film using the same, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Jan 28, 2003·47 cites·8 claims
- 0583US7985806B2Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the sameSHINETSU CHEMICAL CO·Filed 2009·Granted Jul 26, 2011·5 cites·15 claims
- 0683US6294271B1Flip-chip type semiconductor device sealing material and flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Sep 25, 2001·37 cites·3 claims
- 0782US5336786AOrganic silicon compoundsSHINETSU CHEMICAL CO·Filed 1993·Granted Aug 9, 1994·24 cites·6 claims
- 0878US8710158B2Epoxy composition for encapsulating an optical semiconductor elementUENO MANABU·Filed 2011·Granted Apr 29, 2014·3 cites·11 claims
- 0978US8133957B2Resin composition for encapsulating optical semiconductor elementHAMAMOTO YOSHIHIRA·Filed 2009·Granted Mar 13, 2012·3 cites·9 claims
- 1078US6429238B1Flip-chip type semiconductor device sealing material and flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Aug 6, 2002·28 cites·6 claims
- 1170US9147818B2Wavelength conversion sheet filled with large amount of phosphor, method of producing light emitting semiconductor device using the sheet, and light emitting semiconductor deviceSHINETSU CHEMICAL CO·Filed 2012·Granted Sep 29, 2015·1 cites·12 claims
- 1267US7910638B2Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2009·Granted Mar 22, 2011·1 cites·17 claims
- 1367US6383659B1Epoxy resin composition, laminate film using the same, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted May 7, 2002·14 cites·9 claims
- 1463US6506822B2Epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2001·Granted Jan 14, 2003·12 cites·9 claims
- 1561US6210811B1Epoxy resin composition, laminate film using the same, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1999·Granted Apr 3, 2001·25 cites·8 claims
- 1652US9777107B2Silicone-modified epoxy resin and composition and cured article thereofSHINETSU CHEMICAL CO·Filed 2014·Granted Oct 3, 2017·0 cites·5 claims
- 1751US6709756B2Optical device-related adhesive and optical deviceSHINETSU CHEMICAL CO·Filed 2002·Granted Mar 23, 2004·4 cites·14 claims
- 1849US5473091AQuaternary phosphorus compounds and their preparationSHINETSU CHEMICAL CO·Filed 1995·Granted Dec 5, 1995·4 cites·1 claims
- 1945US9963542B2Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of sameSHINETSU CHEMICAL CO·Filed 2015·Granted May 8, 2018·0 cites·8 claims
- 2038US2013072592A1Method of producing cured thin film using photocurable silicone resin compositionINAFUKU KENICHI·Filed 2012·Application pending·0 cites
- 2136US9944760B2Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereofSHINETSU CHEMICAL CO·Filed 2015·Granted Apr 17, 2018·0 cites·10 claims
- 2236US2012142803A1Method for curing a silicone resin compositionINAFUKU KENICHI·Filed 2011·Application pending·0 cites
- 2333US10308803B2Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereofSHINETSU CHEMICAL CO·Filed 2015·Granted Jun 4, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →