Inventor · disambiguated record
Michael Walk
Also filed as: WALK MICHAEL · WALK MICHAEL J
17 granted patents·6 pending applications·709 citations·filing 2000–2015
94Inventor score
Top patents by PatentIndex Score
23 records- 0199US6388207B1Electronic assembly with trench structures and methods of manufactureINTEL CORP·Filed 2000·Granted May 14, 2002·238 cites·52 claims
- 0296US6477034B1Interposer substrate with low inductance capacitive pathsINTEL CORP·Filed 2001·Granted Nov 5, 2002·130 cites·21 claims
- 0396US6407929B1Electronic package having embedded capacitors and method of fabrication thereforINTEL CORP·Filed 2000·Granted Jun 18, 2002·220 cites·29 claims
- 0486US7371975B2Electronic packages and components thereof formed by substrate-imprintingINTEL CORP·Filed 2002·Granted May 13, 2008·28 cites·25 claims
- 0585US7042077B2Integrated circuit package with low modulus layer and capacitor/interposerINTEL CORP·Filed 2004·Granted May 9, 2006·35 cites·19 claims
- 0682US6483692B2Capacitor with extended surface lands and method of fabrication thereforINTEL CORP·Filed 2000·Granted Nov 19, 2002·33 cites·29 claims
- 0766US7594321B2Substrate-imprinting methodsINTEL CORP·Filed 2007·Granted Sep 29, 2009·3 cites·29 claims
- 0860US7589414B2I/O Architecture for integrated circuit packageINTEL CORP·Filed 2007·Granted Sep 15, 2009·1 cites·11 claims
- 0956US6899815B2Multi-layer integrated circuit packageINTEL CORP·Filed 2002·Granted May 31, 2005·7 cites·17 claims
- 1052US7335979B2Device and method for tilted land grid array interconnects on a coreless substrate packageINTEL CORP·Filed 2004·Granted Feb 26, 2008·4 cites·20 claims
- 1152US7186365B2Methods for forming an imprinting toolINTEL CORP·Filed 2003·Granted Mar 6, 2007·3 cites·16 claims
- 1251US7637008B2Methods for manufacturing imprinted substratesINTEL CORP·Filed 2002·Granted Dec 29, 2009·4 cites·21 claims
- 1351US2007056454A1System and apparatus for forming an imprinting toolINTEL CORP·Filed 2006·Application pending·0 cites
- 1447US6897556B2I/O architecture for integrated circuit packageINTEL CORP·Filed 2003·Granted May 24, 2005·3 cites·10 claims
- 1544US7329946B2I/O architecture for integrated circuit packageINTEL CORP·Filed 2005·Granted Feb 12, 2008·0 cites·10 claims
- 1643US7220132B2Tilted land grid array package and socket, systems, and methodsINTEL CORP·Filed 2004·Granted May 22, 2007·0 cites·19 claims
- 1740US7245001B2Multi-layer integrated circuit packageINTEL CORP·Filed 2004·Granted Jul 17, 2007·0 cites·11 claims
- 1838US10347590B2Leadframe for a semiconductor componentCONTI TEMIC MICROELECTRONIC GMBH·Filed 2015·Granted Jul 9, 2019·0 cites·14 claims
- 1938US2005287714A1Enhancing epoxy strength using kaolin fillerWALK MICHAEL·Filed 2004·Application pending·0 cites
- 2037US2005212105A1Integrated circuit die and substrate couplingWALK MICHAEL J·Filed 2004·Application pending·0 cites
- 2136US2006172061A1Method and apparatus for substrate fabricationKOHMURA TOSHIMI·Filed 2003·Application pending·0 cites
- 2234US2004026715A1Package for a non-volatile memory device including integrated passive devices and method for making the sameFiled 2003·Application pending·0 cites
- 2332US2003122173A1Package for a non-volatile memory device including integrated passive devices and method for making the sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →