Inventor · disambiguated record
Mill-Jer Wang
Also filed as: WANG MILL-JER
79 granted patents·8 pending applications·255 citations·filing 2008–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD67WANG MILL-JER9GOEL SANDEEP KUMAR2LIN HUNG-CHIH2TAIWAN SEMICONDUCTOR MFG2
Top patents by PatentIndex Score
87 records- 0198US10741537B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 11, 2020·36 cites·20 claims
- 0297US9664707B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·9 cites·20 claims
- 0397US9453877B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 27, 2016·9 cites·20 claims
- 0497US9341671B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·14 cites·20 claims
- 0596US10067181B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 4, 2018·5 cites·20 claims
- 0695US9086452B2Three-dimensional integrated circuit and method for wireless information access thereofWANG MILL-JER·Filed 2012·Granted Jul 21, 2015·26 cites·20 claims
- 0794US10698026B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·3 cites·20 claims
- 0894US10652987B2Three dimensional integrated circuit electrostatic discharge protection and prevention test interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 12, 2020·5 cites·20 claims
- 0993US8957691B2Probe cards for probing integrated circuitsWANG MILL-JER·Filed 2011·Granted Feb 17, 2015·12 cites·22 claims
- 1092US11340291B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 1191US11335672B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·20 claims
- 1291US8922230B23D IC testing apparatusWANG MILL-JER·Filed 2011·Granted Dec 30, 2014·10 cites·14 claims
- 1390US11726122B2Antenna testing device and method for high frequency antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·2 cites·20 claims
- 1490US9372227B2Integrated circuit test system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 21, 2016·10 cites·17 claims
- 1589US8421073B2Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)LIN HUNG-CHIH·Filed 2011·Granted Apr 16, 2013·10 cites·20 claims
- 1689US2025362335A1Inspection apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1788US8836363B2Probe card partition schemeGOEL SANDEEP KUMAR·Filed 2011·Granted Sep 16, 2014·6 cites·20 claims
- 1888US7750651B2Wafer level test probe cardTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jul 6, 2010·18 cites·10 claims
- 1986US10073135B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·2 cites·20 claims
- 2086US9900970B2Three dimensional integrated circuit electrostatic discharge protection and prevention test interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·2 cites·19 claims
- 2186US9252593B2Three dimensional integrated circuit electrostatic discharge protection and prevention test interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Feb 2, 2016·4 cites·15 claims
- 2285US12322742B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 2385US9754847B2Circuit probing structures and methods for probing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·4 cites·20 claims
- 2485US9671457B23D IC testing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 6, 2017·5 cites·18 claims
- 2585US9658281B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 23, 2017·4 cites·20 claims
- 2685US2025266417A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2784US9859176B1Semiconductor device, test system and method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·4 cites·20 claims
- 2883US2024377446A1Antenna testing device for high frequency antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2982US12105131B2Antenna testing device for high frequency antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 3082US11906573B2Testing module and testing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 20, 2024·0 cites·20 claims
- 3182US11579190B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 14, 2023·0 cites·20 claims
- 3282US10641819B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·1 cites·20 claims
- 3382US9568543B2Structure and method for testing stacked CMOS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·5 cites·18 claims
- 3482US2024133942A1Testing module and testing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3580US11693045B2Testing module and testing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 3680US8866488B2Power compensation in 3DIC testingWANG MILL-JER·Filed 2011·Granted Oct 21, 2014·4 cites·20 claims
- 3780US2024302410A1Probe head structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3879US11855066B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 3979US9817029B2Test probing structureWANG MILL-JER·Filed 2011·Granted Nov 14, 2017·4 cites·20 claims
- 4078US11852672B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 4178US2025343074A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4277US9417285B2Integrated fan-out package-on-package testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·4 cites·17 claims
- 4376US9891266B2Test circuit and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·2 cites·20 claims
- 4475US8956889B2Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC)LIN HUNG-CHIH·Filed 2013·Granted Feb 17, 2015·3 cites·20 claims
- 4574US12062586B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 4674US11029331B2Universal test mechanism for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 8, 2021·2 cites·20 claims
- 4774US9513332B2Probe card partition schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 6, 2016·2 cites·16 claims
- 4874US8146245B2Method for assembling a wafer level test probe cardCHAO CLINTON CHIH-CHIEH·Filed 2010·Granted Apr 3, 2012·4 cites·20 claims
- 4972US11231453B2Alignment testing for tiered semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 5071US11585846B2Testing module and testing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →