Inventor · disambiguated record
Miaomiao Wang
Also filed as: WANG MIAOMIAO
45 granted patents·26 pending applications·27 citations·filing 2014–2024
96Inventor score
Files withIBM53FANUC CORP5GOERTEK INC3SHANGHAI AVIC OPTOELECTRONICS3CHINALCO RESEARCH INSTITUTE OF SCIENCE AND TECH CO LTD2
Top patents by PatentIndex Score
71 records- 0189US9570318B1High-k and p-type work function metal first fabrication process having improved annealing process flowsIBM·Filed 2015·Granted Feb 14, 2017·6 cites·19 claims
- 0284US10038076B2Parasitic capacitance reducing contact structure in a finFETIBM·Filed 2016·Granted Jul 31, 2018·3 cites·19 claims
- 0381US10276558B1Electrostatic discharge protection using vertical fin CMOS technologyIBM·Filed 2017·Granted Apr 30, 2019·3 cites·18 claims
- 0480US10636874B2External resistance reduction with embedded bottom source/drain for vertical transport FETIBM·Filed 2018·Granted Apr 28, 2020·2 cites·17 claims
- 0580US9437445B1Dual fin integration for electron and hole mobility enhancementIBM·Filed 2015·Granted Sep 6, 2016·2 cites·13 claims
- 0679US9620531B2TFT array substrate, display panel and display deviceSHANGHAI AVIC OPTOELECTRONICS·Filed 2015·Granted Apr 11, 2017·3 cites·20 claims
- 0778US12085474B2Apparatus and method for measuring micro-vibration influence of spatial orientation measuring instrumentBEIJING INST CONTROL ENG·Filed 2021·Granted Sep 10, 2024·1 cites·10 claims
- 0878US9874463B2Optical encoder for preventing crosstalkFANUC CORP·Filed 2016·Granted Jan 23, 2018·2 cites·3 claims
- 0977US12100653B2Resistance tunable fuse structure formed by embedded thin metal layersIBM·Filed 2023·Granted Sep 24, 2024·0 cites·17 claims
- 1077US10008507B2Metal FinFET anti-fuseIBM·Filed 2016·Granted Jun 26, 2018·2 cites·12 claims
- 1176US9335591B2Array substrate, display panel and display deviceSHANGHAI AVIC OPTOELECTRONICS·Filed 2014·Granted May 10, 2016·2 cites·17 claims
- 1274US9859281B2Dual FIN integration for electron and hole mobility enhancementIBM·Filed 2016·Granted Jan 2, 2018·1 cites·14 claims
- 1370US12422465B2In-situ chip design for pulse IV self-heating evaluationIBM·Filed 2023·Granted Sep 23, 2025·0 cites·23 claims
- 1469US12464696B2Static random access memory device with stacked FETsIBM·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 1569US11676894B2Resistance tunable fuse structure formed by embedded thin metal layersIBM·Filed 2021·Granted Jun 13, 2023·0 cites·14 claims
- 1664US10903318B2External resistance reduction with embedded bottom source/drain for vertical transport FETIBM·Filed 2020·Granted Jan 26, 2021·0 cites·20 claims
- 1762US2025308717A1Apparatus for testing thermal-state conduction performance of electrical penetration piece of high-temperature gas-cooled reactorHUANENG NUCLEAR ENERGY TECH RESEARCH INSTITUTE CO LTD·Filed 2024·Application pending·0 cites
- 1862US2025385140A1S-parameter design in backside power distribution networkIBM·Filed 2024·Application pending·0 cites
- 1961US10957642B1Resistance tunable fuse structure formed by embedded thin metal layersIBM·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 2061US2025275181A1Isolated backside contact and placeholderIBM·Filed 2024·Application pending·0 cites
- 2161US2025300033A1Sensor for thermal dissipation measurementIBM·Filed 2024·Application pending·0 cites
- 2260US11973141B2Nanosheet transistor with ferroelectric regionIBM·Filed 2021·Granted Apr 30, 2024·0 cites·19 claims
- 2360US2025169145A1Self-aligned backside contact structure for semiconductor device power deliveryIBM·Filed 2023·Application pending·0 cites
- 2460US2025349647A1Thermal Resistance Extraction for Semiconductor DevicesIBM·Filed 2024·Application pending·0 cites
- 2559US11908743B2Planar devices with consistent base dielectricIBM·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 2659US11694958B2Layout design for threshold voltage tuningIBM·Filed 2020·Granted Jul 4, 2023·0 cites·13 claims
- 2759US11493366B2Rotary motion detecting deviceFANUC CORP·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
- 2859US10651123B2High density antifuse co-integrated with vertical FETIBM·Filed 2019·Granted May 12, 2020·0 cites·8 claims
- 2959US9728537B2Dual fin integration for electron and hole mobility enhancementIBM·Filed 2016·Granted Aug 8, 2017·0 cites·4 claims
- 3059US9704867B2Dual fin integration for electron and hole mobility enhancementIBM·Filed 2016·Granted Jul 11, 2017·0 cites·2 claims
- 3158US12490511B2Stacked complementary field effect transistorsIBM·Filed 2021·Granted Dec 2, 2025·0 cites·14 claims
- 3258US11869812B2Stacked complementary field effect transistorsIBM·Filed 2021·Granted Jan 9, 2024·0 cites·7 claims
- 3358US10396183B2Parasitic capacitance reducing contact structure in a finFETIBM·Filed 2017·Granted Aug 27, 2019·0 cites·18 claims
- 3458US10388769B2Parasitic capacitance reducing contact structure in a finFETIBM·Filed 2017·Granted Aug 20, 2019·0 cites·16 claims
- 3558US10388768B2Parasitic capacitance reducing contact structure in a finFETIBM·Filed 2017·Granted Aug 20, 2019·0 cites·17 claims
- 3658US2025029917A1Metal-insulator-metal capacitor via structuresIBM·Filed 2023·Application pending·0 cites
- 3758US2025203933A1Contact and placeholder configuration for backside power delivery devicesIBM·Filed 2023·Application pending·0 cites
- 3858US2025022759A1Test structure for mol reliability evaluationIBM·Filed 2023·Application pending·0 cites
- 3957US2025098240A1Dielectric and two-dimensional semiconductor material nanosheet devicesIBM·Filed 2023·Application pending·0 cites
- 4057US2025113549A1Nanosheet transistors with multi-layered channel structuresIBM·Filed 2023·Application pending·0 cites
- 4157US2023417604A1Self heating extraction design and methodology with power consumption correctionIBM·Filed 2022·Application pending·0 cites
- 4256US2022200870A1Inter-terminal connection state prediction method and apparatus and analysis deviceHUAWEI TECH CO LTD·Filed 2022·Application pending·0 cites
- 4356US2024426895A1Contact resistance test structure for stacked fetsIBM·Filed 2023·Application pending·0 cites
- 4455US12331387B2Modified tin-phosphor bronze alloy and a preparation method thereofCHINALCO RESEARCH INSTITUTE OF SCIENCE AND TECH CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·13 claims
- 4555US10453792B2High density antifuse co-integrated with vertical FETIBM·Filed 2018·Granted Oct 22, 2019·0 cites·12 claims
- 4655US9568340B2Optical encoder including stationary slit part having elastic structureFANUC CORP·Filed 2014·Granted Feb 14, 2017·0 cites·6 claims
- 4755US9349756B2Array substrate, display panel and display deviceSHANGHAI AVIC OPTOELECTRONICS·Filed 2014·Granted May 24, 2016·0 cites·22 claims
- 4855US2024113200A1Inner spacer reliability macro design and well contact formationIBM·Filed 2022·Application pending·0 cites
- 4955US2024285586A1Methods for treating bacterial cell populationsUNIV HONG KONG POLYTECHNIC·Filed 2021·Application pending·0 cites
- 5055US2024127975A1Serial high-temperature gas-cooled reactor nuclear systems and operating methods thereofHUANENG NUCLEAR ENERGY TECH RESEARCH INSTITUTE CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →