Inventor · disambiguated record
Michael Yee-Chih Wang
Also filed as: WANG MICHAEL · Wang Michael Yee-Chih
4 granted patents·1 pending application·3 citations·filing 2016–2024
61Inventor score
Top patents by PatentIndex Score
5 records- 0172US10556305B2Aligning parts using multi-part scanning and feature based coordinate systemsBOEING CO·Filed 2016·Granted Feb 11, 2020·2 cites·20 claims
- 0270US2024395689A1Integrated circuit package with serpentine conductor and method of makingAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 0366US12068232B2Integrated circuit package with serpentine conductor and method of makingAVAGO TECH INT SALES PTE LID·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 0465US11642747B2Aligning parts using multi-part scanning and feature based coordinate systemsBOEING CO·Filed 2019·Granted May 9, 2023·0 cites·20 claims
- 0561US11110667B2Fabrication optimization for composite partsBOEING CO·Filed 2019·Granted Sep 7, 2021·1 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →