Inventor · disambiguated record
Ming-Te We
Also filed as: WE MING-TE
0 granted patents·3 pending applications·0 citations·filing 2008–2012
Top patents by PatentIndex Score
3 records- 0164US2010323161A1Highly adhesive polyimide copper clad laminate and method of making the sameDU PONT·Filed 2009·Application pending·0 cites
- 0252US2009197104A1Highly adhesive polyimide copper clad laminate and method of making the sameDU PONT·Filed 2008·Application pending·0 cites
- 0343US2013244000A1Highly adhesive polyimide copper clad laminate and method of making the sameCHEN YU-JEAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →