Inventor · disambiguated record
Michael C. Weller
Also filed as: WELLER MICHAEL C · WELLER MICHAEL CAMILLO
12 granted patents·1 pending application·174 citations·filing 1991–2003
92Inventor score
Files withIBM12
Top patents by PatentIndex Score
13 records- 0185US6590285B1Method and composition for mounting an electronic component and device formed therewithIBM·Filed 2000·Granted Jul 8, 2003·28 cites·16 claims
- 0272US6425515B2Method and apparatus for micro BGA removal and reattachIBM·Filed 2001·Granted Jul 30, 2002·14 cites·9 claims
- 0372US5044615ADual purpose work board holderIBM·Filed 1991·Granted Sep 3, 1991·39 cites·11 claims
- 0470US6196439B1Method and apparatus for μBGA removal and reattachIBM·Filed 1998·Granted Mar 6, 2001·27 cites·21 claims
- 0562US6589376B1Method and composition for mounting an electronic component and device formed therewithIBM·Filed 1998·Granted Jul 8, 2003·19 cites·16 claims
- 0661US6530412B1Surface mount technology with masked cureIBM·Filed 2000·Granted Mar 11, 2003·7 cites·19 claims
- 0758US6332267B1Process of manufacturing a removably interlockable assemblyIBM·Filed 2000·Granted Dec 25, 2001·6 cites·9 claims
- 0854US6380494B1Micro grid array solder interconnection structure with solder columns for second level packaging joining a module and printed circuit boardIBM·Filed 2000·Granted Apr 30, 2002·4 cites·13 claims
- 0952US6059173AMicro grid array solder interconnection structure for second level packaging joining a module and printed circuit boardIBM·Filed 1998·Granted May 9, 2000·11 cites·12 claims
- 1047US6179625B1Removable interlockable first and second connectors having engaging flexible members and process of making sameIBM·Filed 1999·Granted Jan 30, 2001·10 cites·2 claims
- 1147US6139661ATwo step SMT method using masked cureIBM·Filed 1998·Granted Oct 31, 2000·9 cites·17 claims
- 1241US2004003882A1Method and composition for mounting an electronic component and device formed therewithFiled 2003·Application pending·0 cites
- 1339US6340111B1Micro grid array solder interconnection structure for second level packaging joining a module and a printed circuit boardIBM·Filed 2000·Granted Jan 22, 2002·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →