Inventor · disambiguated record
Ming-Wei Weng
Also filed as: WENG MING-WEI
0 granted patents·2 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0164US2025192095A1Semiconductor package and method for fabricating semiconductor packageTRON FUTURE TECH INC·Filed 2024·Application pending·0 cites
- 0249US2024145421A1Passivation layer for forming semiconductor bonding structure, sputtering target making the same, semiconductor bonding structure and semiconductor bonding processSOLAR APPLIED MATERIALS TECH CORP·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ming-Wei Weng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →