Inventor · disambiguated record
Ming-Hsiao Weng
Also filed as: WENG MING-HSIAO
2 granted patents·2 pending applications·4 citations·filing 2012–2024
42Inventor score
Top patents by PatentIndex Score
4 records- 0190US11852981B2Frequency-picked methodology for diffraction based overlay measurementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·4 cites·20 claims
- 0271US2025147430A1Frequency-picked methodology for diffraction-based overlay measurementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0369US12216412B2Frequency-picked methodology for diffraction-based overlay measurementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0434US2013154172A1Rigidity-Controllable Device and Damping-Controllable Shock-Absorbing Apparatus Comprising the SameNAT UNIV TSING HUA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →