Inventor · disambiguated record
Michael Wise
Also filed as: WISE MICHAEL · WISE MICHAEL L · WISE MICHAEL LESTER
21 granted patents·2 pending applications·623 citations·filing 1997–2015
96Inventor score
Top patents by PatentIndex Score
23 records- 0198US6420216B1Fuse processing using dielectric planarization pillarsIBM·Filed 2000·Granted Jul 16, 2002·331 cites·16 claims
- 0297US9674254B2System and method for using a streaming protocolAOL INC·Filed 2015·Granted Jun 6, 2017·34 cites·17 claims
- 0389US7281750B1Self-adjusting motorcycle windshieldWISE MICHAEL LESTER·Filed 2007·Granted Oct 16, 2007·21 cites·16 claims
- 0484US6437401B1Structure and method for improved isolation in trench storage cellsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 20, 2002·38 cites·24 claims
- 0582US6348395B1Diamond as a polish-stop layer for chemical-mechanical planarization in a damascene process flowIBM·Filed 2000·Granted Feb 19, 2002·25 cites·29 claims
- 0681US6821865B2Deep isolation trenchesINFINEON TECHNOLOGIES AG·Filed 2002·Granted Nov 23, 2004·33 cites·36 claims
- 0776US9184916B2System and method for using a streaming protocolAOL INC·Filed 2013·Granted Nov 10, 2015·2 cites·17 claims
- 0876US8284931B2System and method for using a streaming protocolPARE DAVID F·Filed 2010·Granted Oct 9, 2012·3 cites·20 claims
- 0975US7602908B2System and method for using a streaming protocolAOL LLC·Filed 2004·Granted Oct 13, 2009·13 cites·17 claims
- 1068US8634552B2System and method for using a streaming protocolPARE DAVID F·Filed 2009·Granted Jan 21, 2014·2 cites·18 claims
- 1168US6596580B2Recess Pt structure for high k stacked capacitor in DRAM and FRAM, and the method to form this structureINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jul 22, 2003·12 cites·7 claims
- 1268US5915175AMitigation of CMP-induced BPSG surface damage by an integrated anneal and silicon dioxide depositionSIEMENS AG·Filed 1997·Granted Jun 22, 1999·36 cites·18 claims
- 1366US6794705B2Multi-layer Pt electrode for DRAM and FRAM with high K dielectric materialsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Sep 21, 2004·10 cites·21 claims
- 1463US6696759B2Semiconductor device with diamond-like carbon layer as a polish-stop layerIBM·Filed 2001·Granted Feb 24, 2004·7 cites·1 claims
- 1562US7734042B2System and method for using a streaming protocolAOL INC·Filed 2004·Granted Jun 8, 2010·4 cites·21 claims
- 1662US6379222B2Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor waferSIEMENS AG·Filed 1999·Granted Apr 30, 2002·23 cites·6 claims
- 1753US7319270B2Multi-layer electrode and method of forming the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jan 15, 2008·4 cites·26 claims
- 1853US6020262AMethods and apparatus for chemical mechanical planarization (CMP) of a semiconductor waferSIEMENS AG·Filed 1998·Granted Feb 1, 2000·16 cites·11 claims
- 1952US7698415B1Networked port-inventory system and methodSPRINT COMMUNICATIONS CO·Filed 2004·Granted Apr 13, 2010·6 cites·20 claims
- 2052US2013173921A1System and method for using a streaming protocolPARE DAVID F·Filed 2012·Application pending·0 cites
- 2147US7091103B2TEOS assisted oxide CMP processINFINEON TECHNOLOGIES CORP·Filed 2002·Granted Aug 15, 2006·1 cites·16 claims
- 2246US7270884B2Adhesion layer for Pt on SiO2IBM·Filed 2003·Granted Sep 18, 2007·2 cites·24 claims
- 2338US2004197984A1Adhesion layer for Pt on SiO2INFINEON TECHNOLOGIES CORP·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Michael Wise files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →