Inventor · disambiguated record
Ming Xia Wu
Also filed as: Wu ming xia
2 granted patents·5 citations·filing 2017–2018
43Inventor score
Files withSANDISK SEMICONDUCTOR SHANGHAI CO LTD2
Top patents by PatentIndex Score
2 records- 0181US10483239B2Semiconductor device including dual pad wire bond interconnectionSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2018·Granted Nov 19, 2019·5 cites·22 claims
- 0242US10128218B2Semiconductor device including die bond pads at a die edgeSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted Nov 13, 2018·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →