Inventor · disambiguated record
Miho Yamaguchi
Also filed as: YAMAGUCHI MIHO
25 granted patents·10 pending applications·184 citations·filing 1989–2023
95Inventor score
Top patents by PatentIndex Score
35 records- 0190US7695586B2Photosensitive epoxy resin adhesive composition and use thereofNITTO DENKO CORP·Filed 2007·Granted Apr 13, 2010·8 cites·17 claims
- 0284US6394821B1Anisotropic conductive film and production method thereofNITTO DENKO CORP·Filed 2000·Granted May 28, 2002·34 cites·6 claims
- 0379US6890617B1Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereofNITTO DENKO CORP·Filed 2000·Granted May 10, 2005·16 cites·4 claims
- 0477US8828227B2Method for producing resin porous membrane with adhesive layer, resin porous membrane with adhesive layer, and filter memberNAGAI YOZO·Filed 2012·Granted Sep 9, 2014·3 cites·9 claims
- 0572US10544341B2Thermally conductive polymer composition and thermally conductive molded objectNITTO DENKO CORP·Filed 2014·Granted Jan 28, 2020·1 cites·3 claims
- 0671US6669869B2Anisotropic conductive filmNITTO DENKO CORP·Filed 2002·Granted Dec 30, 2003·17 cites·14 claims
- 0768US8187511B2Method for producing resin porous membrane with adhesive layer, resin porous membrane with adhesive layer, and filter memberNAGAI YOZO·Filed 2007·Granted May 29, 2012·3 cites·2 claims
- 0868US7822308B2Optical waveguide film, optical substrate, and methods for manufacturing the sameNITTO DENKO CORP·Filed 2008·Granted Oct 26, 2010·3 cites·4 claims
- 0966US6613608B1Semiconductor wafer with anisotropic conductor film, and method of manufacture thereofNITTO DENKO CORP·Filed 2000·Granted Sep 2, 2003·13 cites·14 claims
- 1065US6566608B2Production method of anisotropic conductive film and anisotropic conductive film produced by this methodNITTO DENKO CORP·Filed 2001·Granted May 20, 2003·9 cites·5 claims
- 1163US7056406B2Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereofNITTO DENKO CORP·Filed 2003·Granted Jun 6, 2006·2 cites·6 claims
- 1262US12341452B2Control apparatus for rotating electric machineDENSO CORP·Filed 2023·Granted Jun 24, 2025·0 cites·12 claims
- 1362US6667542B2Anisotropic conductive film-containing deviceNITTO DENKO CORP·Filed 2001·Granted Dec 23, 2003·10 cites·4 claims
- 1462US6538309B1Semiconductor device and circuit board for mounting semiconductor elementNITTO DENKO CORP·Filed 2000·Granted Mar 25, 2003·11 cites·9 claims
- 1560US9663635B2Aluminum nitride powder, resin composition, and thermally conductive molded objectNITTO DENKO CORP·Filed 2014·Granted May 30, 2017·0 cites·6 claims
- 1660US6597192B2Test method of semiconductor deviceNITTO DENKO CORP·Filed 2000·Granted Jul 22, 2003·9 cites·6 claims
- 1756US6319619B1Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor deviceNITTO DENKO CORP·Filed 1998·Granted Nov 20, 2001·22 cites·19 claims
- 1856US2006234159A1Photosensitive epoxy resin adhesive composition and use thereofNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 1953US2015090922A1Thermally conductive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2053US2017022407A1Thermally conductive polymer composition and thermally conductive moldingNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2153US2014367883A1Producing method of thermally conductive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2251US8055112B2Methods of manufacturing optical waveguide film and optical substrateNITTO DENKO CORP·Filed 2010·Granted Nov 8, 2011·0 cites·4 claims
- 2351US8055113B2Optical substrate having a supporting substrate and an optical waveguide film adhesively bonded to the supporting substrateNITTO DENKO CORP·Filed 2010·Granted Nov 8, 2011·0 cites·4 claims
- 2449US6709606B2Anisotropic conductive film and production method thereofNITTO DENKO CORP·Filed 2002·Granted Mar 23, 2004·3 cites·5 claims
- 2547US7231706B2Method of manufacturing an anisotropic conductive filmNITTO DENKO CORP·Filed 2003·Granted Jun 19, 2007·2 cites·14 claims
- 2644US5624989ASemiconductor deviceNITTO DENKO CORP·Filed 1995·Granted Apr 29, 1997·12 cites·7 claims
- 2744US2018221951A1Sintered body for forming a rare-earth magnet and rare-earth sintered magnetNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 2843US2013200298A1Thermal conductive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2943US2005153101A1Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereofNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 3041US2014213751A1Epoxy composition and epoxy resin molded articleNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 3140US10867729B2Method for producing sintered body that forms rare-earth permanent magnet and has non-parallel easy magnetization axis orientationNITTO DENKO CORP·Filed 2016·Granted Dec 15, 2020·0 cites·28 claims
- 3236US2017187258A1Permanent magnet, permanent magnet manufacturing method, rotating electric machine, and rotating electric machine manufacturing methodNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 3334US2014008566A1Producing method of thermally conductive sheet and thermally conductive sheetKITAGAWA HISAE·Filed 2012·Application pending·0 cites
- 3431US4903119ASemi-conductor deviceNITTO ELECTRIC IND CO·Filed 1989·Granted Feb 20, 1990·4 cites·3 claims
- 3529US5728763AThermosetting resin composition for semiconductor devicesNITTO DENKO CORP·Filed 1996·Granted Mar 17, 1998·2 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →