Inventor · disambiguated record
Ming-Hsien Yang
Also filed as: YANG MING-HSIEN
17 granted patents·14 pending applications·32 citations·filing 2003–2025
90Inventor score
Top patents by PatentIndex Score
31 records- 0197US11791357B2Composite BSI structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 17, 2023·5 cites·20 claims
- 0294US11211419B2Composite bsi structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·4 cites·20 claims
- 0389US10014340B2Stacked SPAD image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 3, 2018·7 cites·20 claims
- 0488US10948049B2Transmission mechanism and one-way component thereofIND TECH RES INST·Filed 2017·Granted Mar 16, 2021·4 cites·17 claims
- 0584US12148782B2Composite BSI structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 0683US10475758B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·3 cites·20 claims
- 0783US2025359380A1Cmos image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0883US2025359361A1Image sensor and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0982US2024371904A1Composite bsi structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1079US10604009B2Dual-shaft gearbox mechanismIND TECH RES INST·Filed 2018·Granted Mar 31, 2020·2 cites·19 claims
- 1178US2025348648A1Bonded Semiconductor Device And Method For Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1277US2025126912A1Semiconductor image-sensing structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1375US2025063833A1Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1474US12490535B2CMOS image sensor and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 1574US12426394B2CMOS image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1671US12218164B2Semiconductor image-sensing structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 1768US11536349B2One-way component of transmission mechanismIND TECH RES INST·Filed 2021·Granted Dec 27, 2022·0 cites·4 claims
- 1867US12470845B2High dynamic-range (HDR) pixel circuit, color-image sensor package structure, and method for operating HDR pixel circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·20 claims
- 1966US10054224B2Parking brakeIND TECH RES INST·Filed 2016·Granted Aug 21, 2018·1 cites·20 claims
- 2065US12501190B2Multi-wafer stacked CMOS image sensor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 2162US11282802B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 2262US2022277127A1Bonded Semiconductor Device And Method For Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 2362US2025380522A1Image sensor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2459US2025120197A1Semiconductor device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2557US2024395785A1Method of fabricating a wafer stack and wafer stack produced therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2655US2024006425A1Cmos image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2753US2024274636A1Pixel sensor arrays and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2852US9881884B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·0 cites·20 claims
- 2951US2022415938A1Image sensing device and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3047US7156948B2Wet etching apparatusTPO DISPLAYS CORP·Filed 2003·Granted Jan 2, 2007·6 cites·22 claims
- 3141US2020072351A1Gearbox and parking mechanism therofIND TECH RES INST·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →