Inventor · disambiguated record
Minseung Yoon
Also filed as: YOON MINSEUNG
6 granted patents·3 pending applications·64 citations·filing 2009–2023
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0192US8450856B2Semiconductor device and method of forming the sameKANG UN-BYOUNG·Filed 2011·Granted May 28, 2013·18 cites·14 claims
- 0292US8026592B2Through-silicon via structures including conductive protective layersSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 27, 2011·45 cites·18 claims
- 0381US11784131B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·1 cites·11 claims
- 0473US12142573B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 0569US12431474B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 0650US9196505B2Semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 24, 2015·0 cites·10 claims
- 0748US2022301958A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 0840US2011318917A1Methods of forming through-silicon via structures including conductive protective layersYOON MINSEUNG·Filed 2011·Application pending·0 cites
- 0938US2012049349A1Semiconductor chips and methods of forming the sameLEE HO-JIN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →